公开(公告)号：WO2020242864A1

公开(公告)日：2020-12-03

申请号：PCT/US2020/033857

申请日：2020-05-20

Applicant: APPLE INC.

Inventor： HSU, Jun Chung ,  CHUNG, Chih-Ming ,  ZHAI, Jun ,  KAO, Yifan ,  JEON, Young Doo ,  KIM, Taegui

IPC: H01L21/48 ,  H01L23/498

Abstract: Semiconductor packaging substrates and processing sequences are described. In an embodiment, a packaging substrate includes a build-up structure, and a patterned metal contact layer partially embedded within the build-up structure and protruding from the build-up structure. The patterned metal contact layer may include an array of surface mount (SMT) metal bumps in a chip mount area, a metal dam structure or combination thereof.