SYSTEM AND METHOD FOR LASER CUTTING SAPPHIRE USING MULTIPLE GAS MEDIA
    1.
    发明申请
    SYSTEM AND METHOD FOR LASER CUTTING SAPPHIRE USING MULTIPLE GAS MEDIA 审中-公开
    使用多种气体介质激光切割鲷鱼的系统和方法

    公开(公告)号:WO2015116635A1

    公开(公告)日:2015-08-06

    申请号:PCT/US2015/013212

    申请日:2015-01-28

    Applicant: APPLE INC.

    Abstract: A system and a method for manufacturing a sapphire part. A sapphire substrate 300 is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile 302 using a laser 402 and a first gas medium supplied by a gas delivery device 404. The first gas medium is substantially comprised of an inert gas. The sapphire substrate is then irradiated at or near the cut profile using the laser and a second gas medium. The second gas medium is different than the first gas medium comprising oxygen.

    Abstract translation: 一种用于制造蓝宝石部件的系统和方法。 获得用于执行激光切割操作的蓝宝石衬底300。 使用激光器402和由气体输送装置404供应的第一气体介质,沿着切割轮廓302切割蓝宝石衬底。第一气体介质基本上由惰性气体组成。 然后使用激光和第二气体介质在切割轮廓处或附近照射蓝宝石衬底。 第二气体介质与包含氧气的第一气体介质不同。

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