公开(公告)号：WO2023049597A1

公开(公告)日：2023-03-30

申请号：PCT/US2022/075471

申请日：2022-08-25

Applicant: APPLE INC.

Inventor： DABRAL, Sanjay ,  ZHAI, Jun ,  YEH, Jung-Cheng ,  HU, Kunzhong ,  CAMENFORTE, Raymundo ,  HOFFMANN, Thomas

IPC: H01L23/538 ,  H01L23/528 ,  H01L23/522 ,  H01L23/00 ,  H01L25/065 ,  H01L23/66

Abstract: Multi-die structures and methods of fabrication are described. In an embodiment, a multi-die structure includes a first die, a second die, and die-to-die routing connecting the first die to the second die. The die-to-die interconnection may be monolithically integrated as a chip-level die-to-die routing, or external package-level die-to-die routing.