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    Selectively groundable cover ring for substrate process chambers
    2.
    发明授权
    Selectively groundable cover ring for substrate process chambers 有权
    用于基板处理室的选择性可底座盖环

    公开(公告)号：US09472443B2

    公开(公告)日：2016-10-18

    申请号：US13831363

    申请日：2013-03-14

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Muhammad M. Rasheed ,  Kirankumar Savandaiah ,  William Johanson ,  Zhenbin Ge ,  Goichi Yoshidome

    IPC: C23C14/34 ,  H01L21/687 ,  H01J37/32 ,  C23C14/50

    CPC classification number: H01L21/68735 ,  C23C14/34 ,  C23C14/50 ,  H01J37/32651 ,  H01J37/32715

    Abstract: Embodiments of a process kit for substrate process chambers are provided herein. In some embodiments, a process kit for a substrate process chamber may include a ring having a body and a lip extending radially inward from the body, wherein the body has a first annular channel formed in a bottom of the body; an annular conductive shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first annular channel of the ring; and a conductive member electrically coupling the ring to the conductive shield when the ring is disposed on the conductive shield.

    Abstract translation: 本文提供了用于基板处理室的处理套件的实施例。 在一些实施例中，用于衬底处理室的处理套件可以包括具有本体和从主体径向向内延伸的唇缘的环，其中主体具有形成在主体的底部中的第一环形通道; 环形导电屏蔽件，其具有下部向内延伸的凸缘，其终止于构造成与环的第一环形通道相接合的向上延伸部分; 以及当所述环设置在所述导电屏蔽上时，所述导电构件将所述环电耦合到所述导电屏蔽层。

    Etch uniformity improvement for single turn internal coil PVD chamber
    4.
    发明授权
    Etch uniformity improvement for single turn internal coil PVD chamber 有权

    公开(公告)号：US12136544B2

    公开(公告)日：2024-11-05

    申请号：US17865144

    申请日：2022-07-14

    Applicant: Applied Materials, Inc.

    Inventor： Anthony Chih-Tung Chan ,  Adolph Miller Allen ,  Mehul Chauhan ,  Goichi Yoshidome

    IPC: H01J37/34 ,  C23C14/35

    Abstract: Methods and apparatus for generating a magnetic field external to a physical vapor deposition (PVD) chamber to improve etch or deposition uniformity on a substrate disposed inside of the PVD chamber are provided herein. In some embodiments, a process chamber, includes a chamber body defining an interior volume therein; a pedestal disposed in the interior volume for supporting a substrate; a coil disposed in the interior volume above the pedestal; and an external magnet assembly, comprising: a housing coupled to the chamber body; and a plurality of magnets disposed external to the chamber body coupled to the housing and arranged asymmetrically about the chamber body.

    HOLDING ASSEMBLY FOR SUBSTRATE PROCESSING CHAMBER
    6.
    发明申请
    HOLDING ASSEMBLY FOR SUBSTRATE PROCESSING CHAMBER 审中-公开
    用于衬底加工室的保持组件

    公开(公告)号：US20150380223A1

    公开(公告)日：2015-12-31

    申请号：US14846951

    申请日：2015-09-07

    Applicant: Applied Materials, Inc.

    Inventor： Kathleen Scheible ,  Michael Allen Flanigan ,  Goichi Yoshidome ,  Adolph Miller Allen ,  Christopher Pavloff

    IPC: H01J37/34

    CPC classification number: H01J37/3488 ,  C23C14/3407 ,  C23C14/50 ,  H01J37/34 ,  H01J37/3441 ,  H01J37/3447 ,  H01L21/68735

    Abstract: A holding assembly for retaining a deposition ring about a periphery of a substrate support in a substrate processing chamber, the deposition ring comprising a peripheral recessed pocket with a holding post. The holding assembly comprises a restraint beam capable of being attached to the substrate support, the restraint beam comprising two ends, and an anti-lift bracket. The anti-lift bracket comprises a block comprising a through-channel to receive an end of a restraint beam, and a retaining hoop attached to the block, the retaining hoop sized to slide over and encircle the holding post in the peripheral recessed pocket of the deposition ring.

    Abstract translation: 一种保持组件，用于在衬底处理室中保持沉积环周围的衬底支撑件的周边，所述沉积环包括具有保持柱的外围凹槽。 保持组件包括能够附接到基板支撑件的约束梁，包括两个端部的约束梁和防起重托架。 防起重托架包括一个块体，该块体包括用于接纳约束梁的一端的通道，以及附着在该块上的保持环箍，该保持箍的尺寸适于在保持杆的外周凹槽中滑动并围绕 沉积环。

    COIL FOR IMPROVED PROCESS CHAMBER DEPOSITION AND ETCH UNIFORMITY
    7.
    发明申请
    COIL FOR IMPROVED PROCESS CHAMBER DEPOSITION AND ETCH UNIFORMITY 有权

    公开(公告)号：US20220293392A1

    公开(公告)日：2022-09-15

    申请号：US17687157

    申请日：2022-03-04

    Applicant: Applied Materials, Inc.

    Inventor： Rui Li ,  Andrew Tomko ,  Xiangjin Xie ,  Goichi Yoshidome

    IPC: H01J37/32 ,  H05H1/46 ,  H01J37/34

    Abstract: Embodiments of coils for use in process chambers are provided herein. In some embodiments, a coil for use in a process chamber includes: a coil body having a first end portion and an opposing second end portion coupled to the first end portion via a central portion, the coil body having an annular shape with the first end portion and the second end portion disposed adjacent to each other and spaced apart by a gap forming a discontinuity in the annular shape, wherein at least one of the first end portion and the second end portion have a height that is greater than a height of the central portion; and a plurality of hubs coupled to an outer sidewall of the coil body and configured to facilitate coupling the coil to the process chamber, wherein a hub of the plurality of hubs is coupled to each of the first end portion and the second end portion and configured to couple the coil to a power source.

    PVD target for self-centering process shield
    8.
    发明授权
    PVD target for self-centering process shield 有权
    PVD定位自动对中过程屏蔽

    公开(公告)号：US09534286B2

    公开(公告)日：2017-01-03

    申请号：US13837742

    申请日：2013-03-15

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Goichi Yoshidome ,  Ryan Hanson ,  Donny Young ,  Muhammad Rasheed ,  Keith A. Miller

    IPC: C23C14/34 ,  H01J37/34

    CPC classification number: C23C14/3407 ,  H01J37/3414 ,  H01J37/3435 ,  Y10T428/218 ,  Y10T428/219

    Abstract: In some embodiments, a target assembly, for use in a substrate processing chamber having a process shield, may include a backing plate having a first side and an opposing second side, wherein the second side comprises a first surface having a first diameter bounded by a first edge; a target material having a first side bonded to the first surface of the backing plate; wherein the first edge is an interface between the backing plate and the target material; a plurality of slots disposed along an outer periphery of the backing plate extending from the first side of the backing plate toward the second side of the backing plate, wherein the plurality of slots are configured to align the target assembly with respect to the process shield.

    Abstract translation: 在一些实施例中，用于具有过程屏蔽的衬底处理室中的目标组件可以包括具有第一侧和相对的第二侧的背板，其中第二侧包括具有第一直径的第一表面， 第一边 目标材料，其具有接合到所述背板的第一表面的第一侧; 其中所述第一边缘是所述背板和所述目标材料之间的界面; 沿着所述背板的第一侧面延伸到所述背板的所述第二侧面的沿着所述背板的外周设置的多个槽，其中所述多个槽被配置成相对于所述工艺防护罩对准所述目标组件。

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