公开(公告)号：US09543172B2

公开(公告)日：2017-01-10

申请号：US14043091

申请日：2013-10-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Joseph Johnson ,  Joseph M. Ranish ,  John Gerling ,  Mathew Abraham ,  Aaron Muir Hunter ,  Aneesh Nainani

IPC: F26B19/00 ,  F26B3/30 ,  F21V7/00 ,  F24C7/00 ,  H01L21/67

CPC classification number: H01L21/67115 ,  H01L21/67103 ,  H01L21/67109

Abstract: Apparatus for providing heat energy to a process chamber are provided herein. The apparatus may include a process chamber body of the process chamber, a solid state source array having a plurality of solid state sources, disposed on a first substrate, to provide heat energy to the process chamber to heat a target component disposed in the process chamber body, and at least one reflector disposed on the first substrate proximate to one or more of the plurality of solid state sources to direct heat energy provided by the one or more of the plurality of solid state sources towards the target component.

Abstract translation: 本文提供了用于向处理室提供热能的设备。 该装置可以包括处理室的处理室主体，具有多个固态源的固态源阵列，其设置在第一基板上，以向处理室提供热能，以加热设置在处理室中的目标部件 主体和至少一个反射器，其布置在靠近所述多个固态源中的一个或多个固态源的第一基板上，以将由所述多个固态源中的一个或多个的所述固态源提供的热能引导到所述目标部件。

公开(公告)号：US09754807B2

公开(公告)日：2017-09-05

申请号：US14182879

申请日：2014-02-18

Applicant: APPLIED MATERIALS, INC.

Inventor： John Gerling ,  Joseph M. Ranish ,  Oleg V. Serebryanov ,  Joseph Johnson

IPC: H01L21/67 ,  C23C14/54 ,  C23C16/46

CPC classification number: H01L21/67115 ,  C23C14/541 ,  C23C16/46

Abstract: Apparatus for providing pulsed or continuous energy in a process chamber are provided herein. The apparatus may include: a process chamber body of the semiconductor process chamber; one or more solid state source arrays providing pulsed or continuous energy to the process chamber, wherein each of the one or more solid state source arrays include a substrate having a plurality of solid state light sources disposed on a first surface of the substrate, wherein the plurality of solid state light sources are connected in series and in a recursive pattern on the first surface of the substrate, and a heat sink coupled to a second surface of the substrate configured to remove heat from the substrate; and a power source coupled to the one or more solid state source arrays to electrically power the plurality of solid state sources.

公开(公告)号：US09232569B2

公开(公告)日：2016-01-05

申请号：US13779004

申请日：2013-02-27

Applicant: APPLIED MATERIALS, INC.

Inventor： Joseph Johnson ,  John Gerling ,  Klaus Schuegraf

IPC: A21B1/00 ,  H05B3/00 ,  H01L21/67

CPC classification number: H05B3/0038 ,  H01L21/67115

Abstract: Apparatus for providing pulsed or continuous energy in a process chamber are provided herein. The apparatus may include a lamphead including a set of lamps, wherein the first set of lamps are not solid state light sources, and a set of solid state light sources disposed on the lamp head, to provide pulsed or continuous energy to the process chamber.

Abstract translation: 本文提供了用于在处理室中提供脉冲或连续能量的装置。 该装置可以包括包括一组灯的灯头，其中第一组灯不是固态光源，并且一组固态光源设置在灯头上，以向处理室提供脉冲或连续的能量。