Abstract:
PROBLEM TO BE SOLVED: To augment the corrosion rate of a silicon nitride by a method wherein a composite semiconductor device is made to corrode in a heating water solution containing a silicon-containing composition easily soluble in a phospholic acid and a water corrosion solution. SOLUTION: The total number of particles is set at 100 particle/ml or less, and at the same time, the size of the particles is set at 0.5 μ or smaller to add the amount of about 16 to 500 ppm of an easily soluble silicon-containing composition, which is a hexafluorosilicic acid, to an electron-grade phospholic acid solution existing at ppm to ppb/l of a low level in metallic ions or an acid and a water corrosion solution at a temperature of 150 to 180 deg.C and a composite semiconductor device is corroded in a water solution. Accordingly, the corrosion rate and selectivity of a silicon nitride can be augmented by executing a corrosion operation in a heating corrosion bath containing a phospholic acid and a silicon-containing composition soluble easily in a corrosion bath.
Abstract:
An aqueous composition comprising ammonium hydroxide in an amount of about 1 to about 30 % by weight calculated as NH3 and a surface active agent represented by the formula XF2C (CFY)n SO3A wherein X=F, OH or SO3A; Y=F, H, OH or may be omitted thereby creating a double bond; n=1-12; A=NH4 , H , Na , K , Li , R or organic amine cation and R is 1-4 straight chain alkyl group; and wherein the fluoroalkyl group is a linear group; and wherein the surface active agent is present in an amount of about 5 ppm to about 2000 ppm is useful for cleaning photomasks and especially chromium photomasks.
Abstract translation:一种水性组合物,其包含按NH 3计算的约1至约30重量%的氢氧化铵和由式XF2C(CFY)n SO3A表示的表面活性剂,其中X = F,OH或SO 3 A; Y = F,H,OH或可以省略,从而产生双键; N = 1-12; A = NH 4 +,H +,Na +,K +,Li +,R +或有机胺阳离子,R为1-4直链烷基; 并且其中所述氟烷基是线性基团; 并且其中表面活性剂以约5ppm至约2000ppm的量存在可用于清洁光掩模,特别是铬光掩模。
Abstract:
A method of making high purity acids and their derivatives, particularly citric acid and ammonium citrate. These purified compositions are useful in the manufacture of integrated circuits for the semiconductor industry. Purification is done using strong acid ion exchange resins.
Abstract:
The invention relates to an aqueous phosphoric acid etch bath composition with a readily soluble silicon containing composition. The baths are used in the etching step of composite semiconductor device manufacturing.
Abstract:
The invention relates to an aqueous phosphoric acid etch bath composition with a readily soluble silicon containing composition. The baths are used in the etching step of composite semiconductor device manufacturing.
Abstract:
The invention relates to an aqueous phosphoric acid etch bath composition with a readily soluble silicon containing composition. The baths are used in the etching step of composite semiconductor device manufacturing.
Abstract:
The invention relates to an aqueous phosphoric acid etch bath composition with a readily soluble silicon containing composition. The baths are used in the etching step of composite semiconductor device manufacturing.
Abstract:
A method of making high purity acids and their derivatives, particularly citric acid and ammonium citrate. These purified compositions are useful in the manufacture of integrated circuits for the semiconductor industry. Purification is done using strong acid ion exchange resins. 00000
Abstract:
A method of making high purity acids and their derivatives, particularly citric acid and ammonium citrate. These purified compositions are useful in the manufacture of integrated circuits for the semiconductor industry. Purification is done using strong acid ion exchange resins.