公开(公告)号：USD1023959S1

公开(公告)日：2024-04-23

申请号：US29782976

申请日：2021-05-11

Applicant: ASM IP Holding B.V.

Designer： JeongHo Lee ,  JaeHyun Kim ,  JinHo Shin ,  HyunSoo Jang

Abstract: FIG. 1 is a top perspective view of an electrode for substrate processing apparatus showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a side elevation view thereof; and,
FIG. 6 is a cross-sectional view, taken along a line 6-6 of FIG. 3.

公开(公告)号：USD980813S1

公开(公告)日：2023-03-14

申请号：US29782977

申请日：2021-05-11

Applicant: ASM IP Holding B.V.

Designer： JinHo Shin ,  JaeHyun Kim ,  JeongHo Lee ,  HyunSoo Jang

公开(公告)号：US20210319982A1

公开(公告)日：2021-10-14

申请号：US17224779

申请日：2021-04-07

Applicant: ASM IP Holding B.V.

Inventor： JaeHyun Kim ,  DaeYoun Kim ,  JeongHo Lee ,  HyunSoo Jang ,  YonJong Jeon

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/52

Abstract: A substrate processing apparatus capable of preventing power dissipation and achieving high process reproducibility includes a partition and a processing unit below the partition, wherein the processing unit includes a conductive body and at least one conductive protrusion integrally formed with the conductive body.

公开(公告)号：USD1012873S1

公开(公告)日：2024-01-30

申请号：US29752090

申请日：2020-09-24

Applicant: ASM IP Holding B.V.

Designer： JaeHyun Kim ,  JeongHo Lee ,  HyunSoo Jang

Abstract: FIG. 1 is a top perspective view of an electrode for semiconductor processing apparatus showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a cross-sectional view, taken along line 5-5 of FIG. 3;
FIG. 6 is a cross-sectional view, taken along line 6-6 of FIG. 3;
FIG. 7 is an enlarged view of area 7 encircled in FIG. 1;
FIG. 8 is an enlarged view of area 8 encircled in FIG. 2; and,
FIG. 9 is an enlarged view of area 9 encircled in FIG. 3.
The dash-dot-dash broken lines illustrate the bounds of the portions shown enlarged in the drawings and form no part of the claimed design.

公开(公告)号：USD980814S1

公开(公告)日：2023-03-14

申请号：US29782978

申请日：2021-05-11

Applicant: ASM IP Holding B.V.

Designer： JinHo Shin ,  JaeHyun Kim ,  JeongHo Lee ,  HyunSoo Jang