公开(公告)号：WO2020239373A1

公开(公告)日：2020-12-03

申请号：PCT/EP2020/062463

申请日：2020-05-05

Applicant: ASML HOLDING N.V. ,  ASML NETHERLANDS B.V.

Inventor： LIPSON, Matthew ,  ACHANTA, Satish ,  DAWSON, Benjamin, David ,  SORNA, Matthew, Anthony ,  SIGAL, Iliya ,  UITTERDIJK, Tammo

IPC: G03F7/20 ,  H01L21/687

Abstract: A substrate table for supporting a substrate includes a surface and coarse burls. Each of the coarse burls includes a burl-top surface and fine burls. The coarse burls are disposed on the surface of the substrate table. The fine burls are disposed on the burl-top surface. The fine burls contact the substrate when the substrate table supports the substrate.

公开(公告)号：WO2022144144A1

公开(公告)日：2022-07-07

申请号：PCT/EP2021/084066

申请日：2021-12-02

Applicant: ASML HOLDING N.V. ,  ASML NETHERLANDS B.V.

Inventor： ALIKHAN, Abdullah ,  UITTERDIJK, Tammo ,  ENGELEN, Johannes, Bernardus, Charles ,  KAMIENIECKI, Daniel ,  VAN DE VEN, Bastiaan, Lambertus, Wilhelmus, Marinus ,  POIESZ, Thomas ,  LEVASIER, Leon, Martin ,  OVERKAMP, Jim, Vincent ,  PIJNENBURG, Johannes, Adrianus, Cornelis, Maria ,  VAN BERKEL, Koos ,  DIGUIDO, Gregory, James ,  SOCCI, JR., Anthony, C. ,  SIGAL, Iliya ,  LOMANS, Bram, Antonius, Gerardus ,  HABETS, Michel, Ben, Isel

IPC: G03F7/20 ,  H01L21/683 ,  H01L21/687

Abstract: Systems, apparatuses, and methods are provided for manufacturing a substrate table. An example method can include forming a vacuum sheet including a plurality of vacuum connections and a plurality of recesses configured to receive a plurality of burls disposed on a core body for supporting an object such as a wafer. Optionally, at least one burl can be surrounded, partially or wholly, by a trench. The example method can further include using the vacuum sheet to mount the core body to an electrostatic sheet including a plurality of apertures configured to receive the plurality of burls. Optionally, the example method can include using the vacuum sheet to mount the core body to the electrostatic sheet such that the plurality of recesses of the vacuum sheet line up with the plurality of burls of the core body and the plurality of apertures of the electrostatic sheet.

公开(公告)号：WO2019120921A1

公开(公告)日：2019-06-27

申请号：PCT/EP2018/082984

申请日：2018-11-29

Applicant: ASML HOLDING N.V.

Inventor： LIPSON, Matthew ,  HEALD, David, Allen ,  SIGAL, Iliya

IPC: G03F7/20 ,  H01L21/687

CPC classification number: G03F7/70783 ,  G03F7/707 ,  H01L21/6875 ,  H01L21/68757

Abstract: Methods and systems are described for reducing adhesion and controlling friction between a wafer and a wafer table during semiconductor photolithography wherein the tops of burls on the wafer table have a layer with a nanoscale topography.