-
公开(公告)号：US12271114B2
公开(公告)日：2025-04-08
申请号：US17441729
申请日：2020-03-26
Applicant: ASML NETHERLANDS B.V.
Inventor： Scott Anderson Middlebrooks , Adrianus Cornelis Matheus Koopman , Markus Gerardus Martinus Maria Van Kraaij , Maxim Pisarenco , Stefan Hunsche
Abstract: A method for training a machine learning model configured to predict a substrate image corresponding to a printed pattern of a substrate as measured via a metrology tool. The method involves obtaining a training data set including (i) metrology data of the metrology tool used to measure the printed pattern of the substrate, and (ii) a representation of a mask pattern employed for imaging the printed pattern on the substrate; and training, based on the training data set, a machine learning model to predict the substrate image of the substrate as measured by the metrology tool such that a cost function is improved, wherein the cost function includes a relationship between the predicted substrate image and the metrology data.
-
2.发明授权公开(公告)号：US11940740B2
公开(公告)日：2024-03-26
申请号：US17836099
申请日：2022-06-09
Applicant: ASML Netherlands B.V.
Inventor： Alexander Ypma , Jasper Menger , David Deckers , David Han , Adrianus Cornelis Matheus Koopman , Irina Lyulina , Scott Anderson Middlebrooks , Richard Johannes Franciscus Van Haren , Jochem Sebastiaan Wildenberg
CPC classification number: G03F7/706837 , G03F7/70525 , G03F7/70616 , G03F9/7092 , G06F16/26
Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
-
公开(公告)号：US10437157B2
公开(公告)日：2019-10-08
申请号：US15533309
申请日：2015-11-13
Applicant: ASML Netherlands B.V.
Inventor： Scott Anderson Middlebrooks , Markus Gerardus Martinus Maria Van Kraaij , Adrianus Cornelis Matheus Koopman , Stefan Hunsche , Willem Marie Julia Marcel Coene
Abstract: A method and apparatus of detection, registration and quantification of an image. The method may include obtaining an image of a lithographically created structure, and applying a level set method to an object, representing the structure, of the image to create a mathematical representation of the structure. The method may include obtaining a first dataset representative of a reference image object of a structure at a nominal condition of a parameter, and obtaining second dataset representative of a template image object of the structure at a non-nominal condition of the parameter. The method may further include obtaining a deformation field representative of changes between the first dataset and the second dataset. The deformation field may be generated by transforming the second dataset to project the template image object onto the reference image object. A dependence relationship between the deformation field and change in the parameter may be obtained.
-
4.发明申请METHODS AND APPARATUS FOR OBTAINING DIAGNOSTIC INFORMATION RELATING TO AN INDUSTRIAL PROCESS 有权获取与工业过程相关的诊断信息的方法和装置公开(公告)号：US20160246185A1
公开(公告)日：2016-08-25
申请号：US15025856
申请日：2014-09-05
Applicant: ASML Netherlands B.V.
Inventor： Alexander Ypma , Jasper Menger , David Deckers , David Han , Adrianus Cornelis Matheus Koopman , Irina Lyulina , Scott Anderson Middlebrooks , Richard Johannes Franciscus Van Haren , Jochem Sebastiaan Wildenberg
CPC classification number: G03F7/70616 , G03F7/70508 , G03F7/70525 , G03F7/70625 , G03F7/70633 , G03F7/70641 , G03F9/7092 , G06F17/30572
Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
Abstract translation: 在光刻工艺中，诸如半导体晶片的产品单元经受光刻图案化操作和化学和物理处理操作。 在执行过程期间分阶段进行对准数据或其他测量，以获得表示在空间上分布在每个单元上的点处测量的位置偏差或其他参数的对象数据。 该对象数据用于通过执行多变量分析来获取诊断信息，以将表示所述多维空间中的单位的向量集合分解为一个或多个分量向量。 使用分量向量提取关于工业过程的诊断信息。 可以基于提取的诊断信息来控制后续产品单元的工业过程的性能。
-
公开(公告)号：US11442368B2
公开(公告)日：2022-09-13
申请号：US17051287
申请日：2019-04-05
Applicant: ASML NETHERLANDS B.V.
Inventor： Richard Quintanilha , Scott Anderson Middlebrooks , Adrianus Cornelis Matheus Koopman , Albertus Victor Gerardus Mangnus
Abstract: A method of determining a measurement sequence for an inspection tool inspecting a structure generated by a lithographic process performed by a lithographic system is presented, the method including deriving a model for the lithographic process as performed by the lithographic system, the model including a relationship between a set of system variables describing the lithographic system and an output variable representing the structure resulting of the lithographic process, determining an observability of one or more system variables in the output variable, and determining the measurement sequence for the inspection tool, based on the observability.
-
Patent Agency Ranking
6.发明授权公开(公告)号：US11385550B2
公开(公告)日：2022-07-12
申请号：US16864456
申请日：2020-05-01
Applicant: ASML Netherlands B.V.
Inventor： Alexander Ypma , Jasper Menger , David Deckers , David Han , Adrianus Cornelis Matheus Koopman , Irina Lyulina , Scott Anderson Middlebrooks , Richard Johannes Franciscus Van Haren , Jochem Sebastiaan Wildenberg
Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
-
公开(公告)号：US11119414B2
公开(公告)日：2021-09-14
申请号：US16851477
申请日：2020-04-17
Applicant: ASML Netherlands B.V.
Inventor： Scott Anderson Middlebrooks , Willem Maria Julia Marcel Coene , Frank Arnoldus Johannes Maria Driessen , Adrianus Cornelis Matheus Koopman , Markus Gerardus Martinus Maria Van Kraaij
IPC: G06F15/18 , G03F7/20 , G06N20/00 , G06F30/367 , G06N7/00
Abstract: A defect prediction method for a device manufacturing process involving production substrates processed by a lithographic apparatus, the method including training a classification model using a training set including measured or determined values of a process parameter associated with the production substrates processed by the device manufacturing process and an indication regarding existence of defects associated with the production substrates processed in the device manufacturing process under the values of the process parameter, and producing an output from the classification model that indicates a prediction of a defect for a substrate.
-
公开(公告)号：US11067901B2
公开(公告)日：2021-07-20
申请号：US16464705
申请日：2017-11-29
Applicant: ASML NETHERLANDS B.V.
Inventor： Scott Anderson Middlebrooks , Adrianus Cornelis Matheus Koopman , Markus Gerardus Martinus Maria Van Kraaij , Maxim Pisarenco
Abstract: A method including: obtaining a logistic mathematical model predicting the formation of a physical structure created using a patterning process; evaluating the logistic mathematical model to predict formation of a part of the physical structure and generate an output; and adapting, based on the output, an aspect of the patterning process.
-
9.发明授权公开(公告)号：US12287584B2
公开(公告)日：2025-04-29
申请号：US18232570
申请日：2023-08-10
Applicant: ASML Netherlands B.V.
Inventor： Alexander Ypma , Jasper Menger , David Deckers , David Han , Adrianus Cornelis Matheus Koopman , Irina Lyulina , Scott Anderson Middlebrooks , Richard Johannes Franciscus Van Haren , Jochem Sebastiaan Wildenberg
Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
-
10.发明授权公开(公告)号：US12112260B2
公开(公告)日：2024-10-08
申请号：US16424811
申请日：2019-05-29
Applicant: ASML Netherlands B.V.
Inventor： Lorenzo Tripodi , Patrick Warnaar , Grzegorz Grzela , Mohammadreza Hajiahmadi , Farzad Farhadzadeh , Patricius Aloysius Jacobus Tinnemans , Scott Anderson Middlebrooks , Adrianus Cornelis Matheus Koopman , Frank Staals , Brennan Peterson , Anton Bernhard Van Oosten
CPC classification number: G06N3/08 , G01B11/02 , G01N21/55 , G06T7/0006 , G06T7/001 , G01B2210/56 , G06T2207/20081 , G06T2207/20084 , G06T2207/30148
Abstract: Disclosed is a method of determining a characteristic of interest relating to a structure on a substrate formed by a lithographic process, the method comprising: obtaining an input image of the structure; and using a trained neural network to determine the characteristic of interest from said input image. Also disclosed is a reticle comprising a target forming feature comprising more than two sub-features each having different sensitivities to a characteristic of interest when imaged onto a substrate to form a corresponding target structure on said substrate. Related methods and apparatuses are also described.
-
-
-
-
-
-
-
-
-
Search Results
25
records
(took 0.027 seconds)
