公开(公告)号：US20240118629A1

公开(公告)日：2024-04-11

申请号：US17766585

申请日：2020-10-05

Applicant: ASML NETHERLANDS B.V.

Inventor： Aliasghar KEYVANI JANBAHAN ,  Frans Reinier SPIERING ,  Jochem Sebastiaan WILDENBERG ,  Everhardus Cornelis MOS

IPC: G03F7/00

CPC classification number: G03F7/706839 ,  G03F7/706837 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/70641

Abstract: A method of processing measurement data relating to a substrate processed by a manufacturing process. The method includes obtaining measurement data relating to a performance parameter for at least a portion of the substrate; and fitting the measurement data to a model by minimizing a complexity metric applied to fitting parameters of the model while not allowing the deviation between the measurement data and the fitted model to exceed a threshold value.

公开(公告)号：US20240231233A9

公开(公告)日：2024-07-11

申请号：US18277223

申请日：2022-02-07

Applicant: ASML NETHERLANDS B.V.

Inventor： Niek Willem KLEIN KOERKAMP ,  Marc HAUPTMANN ,  Aliasghar KEYVANI JANBAHAN ,  Jingchao WANG

IPC: G03F7/20 ,  H01L21/66

CPC classification number: G03F7/20 ,  H01L22/10

Abstract: Methods and apparatus for characterizing a semiconductor manufacturing process performed on a substrate. First data is obtained associated with fingerprint data of the substrate measured after a first processing step. Second data is obtained associated with fingerprint data of the substrate measured after a second processing step. A statistical model is used to decompose the first and second data into a first class of fingerprint components mutually correlating between the first and second data and a second class of fingerprint components not mutually correlating between the first and second data. At least one of the first class fingerprint of components and the second class of fingerprint components are used to characterize the semiconductor manufacturing process.

公开(公告)号：US20240134283A1

公开(公告)日：2024-04-25

申请号：US18277223

申请日：2022-02-07

Applicant: ASML NETHERLANDS B.V.

Inventor： Niek Willem KLEIN KOERKAMP ,  Marc HAUPTMANN ,  Aliasghar KEYVANI JANBAHAN ,  Jingchao WANG

IPC: G03F7/20 ,  H01L21/66

CPC classification number: G03F7/20 ,  H01L22/10

Abstract: Methods and apparatus for characterizing a semiconductor manufacturing process performed on a substrate. First data is obtained associated with fingerprint data of the substrate measured after a first processing step. Second data is obtained associated with fingerprint data of the substrate measured after a second processing step. A statistical model is used to decompose the first and second data into a first class of fingerprint components mutually correlating between the first and second data and a second class of fingerprint components not mutually correlating between the first and second data. At least one of the first class fingerprint of components and the second class of fingerprint components are used to characterize the semiconductor manufacturing process.