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公开(公告)号:US20220291593A1
公开(公告)日:2022-09-15
申请号:US17639364
申请日:2020-08-05
Applicant: ASML NETHERLANDS B.V.
Inventor: Roy WERKMAN , Pui Leng LAM , Blandine Marie Andree Richit MINGHETTI , Vahid BASTANI , Mohamadrezh HAJIAHMADI , Lydia Marianna VERGAIJ-HUIZER , Frans Reinier SPIERING
Abstract: A method for characterizing a patterning process, the method including obtaining a plurality of values of stitching errors made along one or more boundaries between at least two patterned adjacent fields or sub-fields on a substrate; and fitting, using a hardware computer system, a distortion model to the plurality of values to obtain a fingerprint representing deformation of a field or sub-field out of the at least two patterned adjacent fields or sub-fields.