公开(公告)号：US20220351075A1

公开(公告)日：2022-11-03

申请号：US17624014

申请日：2020-06-05

Applicant: ASML NETHERLANDS B.V.

Inventor： Vahid BASTANI ,  Dag SONNTAG ,  Reza SAHRAEIAN ,  Dimitra GKOROU

IPC: G06N20/00 ,  G03F7/20

Abstract: A method of determining a contribution of a process feature to the performance of a process of patterning substrates. The method may include obtaining a first model trained on first process data and first performance data. One or more substrates may be identified based on a quality of prediction of the first model when applied to process data associated with the one or more substrates. A second model may be trained on second process data and second performance data associated with the identified one or more substrates. The second model may be used to determine the contribution of a process feature of the second process data to the second performance data associated with the one or more substrates.

公开(公告)号：US20230316103A1

公开(公告)日：2023-10-05

申请号：US18013636

申请日：2021-06-21

Applicant: ASML NETHERLANDS B.V.

Inventor： Vahid BASTANI ,  Dimitra GKOROU ,  Reza SAHRAEIAN ,  Cyrus Emil TABERY

IPC: G06N5/022 ,  H01L21/66

CPC classification number: G06N5/022 ,  H01L22/20

Abstract: Methods and apparatus for classifying semiconductor wafers. The method can include: sorting a set of semiconductor wafers, using a model, into a plurality of sub-sets based on parameter data corresponding to one or more parameters of the set of semiconductor wafers, wherein the parameter data for semiconductor wafers in a sub-set include one or more common characteristics; identifying one or more semiconductor wafers within a sub-set based on a probability of the one or more semiconductor wafers being correctly allocated to the sub-set; comparing the parameter data of the one or more identified semiconductor wafers to reference parameter data; and reconfiguring the model based on the comparison. The comparison is undertaken by a human to provide constraints for the model. The apparatus can be configured to undertake the method.

公开(公告)号：US20210116818A1

公开(公告)日：2021-04-22

申请号：US17044771

申请日：2019-03-04

Applicant: ASML NETHERLANDS B.V.

Inventor： Vahid BASTANI ,  Alexander YPMA

IPC: G03F7/20

Abstract: A method of grouping data associated with substrates undergoing a process step of a manufacturing process is disclosed. The method includes obtaining first data associated with substrates before being subject to the process step and obtaining a plurality of sets of second data associated with substrates after being subject to the process step, each set of second data being associated with a different value of a characteristic of the first data. A distance metric is determined which describes a measure of distance between the sets of second data, and the second data is grouped based on a property of the distance metric.

公开(公告)号：US20230341784A1

公开(公告)日：2023-10-26

申请号：US18016811

申请日：2021-07-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Tijmen Pieter COLLIGNON ,  Pavel SMAL ,  Cyrus Emil TABERY ,  Thiago DOS SANTOS GUZELLA ,  Vahid BASTANI

IPC: G03F7/00 ,  G03F9/00

CPC classification number: G03F7/70508 ,  G03F9/7034 ,  G03F9/7026 ,  G03F7/70908 ,  G03F7/70516

Abstract: Methods and associated apparatus for identifying contamination in a semiconductor fab. The methods include determining contamination map data for a plurality of semiconductor wafers clamped to a wafer table after being processed in the semiconductor fab. Combined contamination map data is determined based, at least in part, on a combination of the contamination map data of the plurality of semiconductor wafers. The combined contamination map data is combined to reference data. The reference data include one or more values for the combined contamination map data that are indicative of contamination in one or more tools in the semiconductor fab.

公开(公告)号：US20220291593A1

公开(公告)日：2022-09-15

申请号：US17639364

申请日：2020-08-05

Applicant: ASML NETHERLANDS B.V.

Inventor： Roy WERKMAN ,  Pui Leng LAM ,  Blandine Marie Andree Richit MINGHETTI ,  Vahid BASTANI ,  Mohamadrezh HAJIAHMADI ,  Lydia Marianna VERGAIJ-HUIZER ,  Frans Reinier SPIERING

IPC: G03F7/20 ,  G03F1/42

Abstract: A method for characterizing a patterning process, the method including obtaining a plurality of values of stitching errors made along one or more boundaries between at least two patterned adjacent fields or sub-fields on a substrate; and fitting, using a hardware computer system, a distortion model to the plurality of values to obtain a fingerprint representing deformation of a field or sub-field out of the at least two patterned adjacent fields or sub-fields.

公开(公告)号：US20250147436A1

公开(公告)日：2025-05-08

申请号：US18832408

申请日：2023-01-23

Applicant: ASML NETHERLANDS B.V.

Inventor： Chrysostomos BATISTAKIS ,  Huaichen ZHANG ,  Maxim PISARENCO ,  Vahid BASTANI ,  Konstantin Sergeevich NECHAEV ,  Roy ANUNCIADO ,  Stefan Cornelis Theodorus VAN DER SANDEN

IPC: G03F7/00

Abstract: A method for determining a parameter of interest relating to at least one structure formed on a substrate in a manufacturing process. The method includes: obtaining layout data relating to a layout of a pattern to be applied to the at least one structure, the pattern including the at least one structure; and obtaining a trained model, having been trained on metrology data and the layout data to infer a value and/or probability metric relating to a parameter of interest from at least the layout data, the metrology data relating to a plurality of measurements of the parameter of interest at a respective plurality of measurement locations on the substrate. A value and/or probability metric is determined relating to the parameter of interest at one or more locations on the substrate different from the measurement locations from at least layout data using the trained model.

公开(公告)号：US20210157247A1

公开(公告)日：2021-05-27

申请号：US16493326

申请日：2018-04-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Alexander YPMA ,  Vahid BASTANI ,  Dag SONNTAG ,  Jelle NIJE ,  Hakki Ergün CEKLI ,  Georgios TSIROGIANNIS ,  Robert Jan VAN WIJK

IPC: G03F7/20

Abstract: A method of maintaining a set of fingerprints representing variation of one or more process parameters across wafers subjected to a device manufacturing method, the method including: receiving measurement data of one or more parameters measured on wafers; updating the set of fingerprints based on an expected evolution of the one or more process parameters; and evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence, and the decomposition may involve: estimating, based the received measurement data, likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.

公开(公告)号：US20190271919A1

公开(公告)日：2019-09-05

申请号：US16461044

申请日：2018-05-23

Applicant: ASML NETHERLANDS B.V.

Inventor： Davit HARUTYUNYAN ,  Fei JIA ,  Frank STAALS ,  Fuming WANG ,  Hugo Thomas LOOIJESTIJN ,  Cornelis Johannes RIJNIERSE ,  Maxim PISARENCO ,  Roy WERKMAN ,  Thomas THEEUWES ,  Tom VAN HEMERT ,  Vahid BASTANI ,  Jochem Sebastian WILDENBERG ,  Everhardus Cornelis MOS ,  Erik Johannes Maria WALLERBOS

IPC: G03F7/20

Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method including: obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.

公开(公告)号：US20240402618A1

公开(公告)日：2024-12-05

申请号：US18698578

申请日：2022-09-30

Applicant: ASML NETHERLANDS B.V.

Inventor： Vahid BASTANI ,  Raoul Maarten Simon KNOPS ,  Thomas THEEUWES ,  Adam Jan URBANCZYK ,  Jochem Sebastiaan WILDENBERG ,  Robert Jan VAN WIJK

IPC: G03F7/00

Abstract: A method of determining a performance parameter distribution and/or associated quantile function. The method includes obtaining a quantile function prediction model operable to predict a quantile value for a substrate position and given quantile probability such that the predicted quantile values vary monotonically as a function of quantile probability and using the trained quantile 5 function prediction model to predict quantile values for a plurality of different quantile probabilities for one or more locations on the substrate.

公开(公告)号：US20240346200A1

公开(公告)日：2024-10-17

申请号：US18683124

申请日：2022-08-04

Applicant: ASML NETHERLANDS B.V.

Inventor： Vahid BASTANI ,  Yichen ZHANG ,  Marsil DE ATHAYDE COSTA E SILVA ,  Hermanus Adrianus DILLEN ,  Robert Jan VAN WIJK

IPC: G06F30/17 ,  G06F30/27

CPC classification number: G06F30/17 ,  G06F30/27

Abstract: A computer implemented method of determining a placement metric relating to placement of one or more features on a substrate in a lithographic process. The method includes obtaining setup data including placement error contributor data relating to a plurality of placement error contributor parameters and yield data representative of yield and defining a statistical model for predicting a yield metric, the statistical model being based on a placement metric, the placement metric being a function of the placement error contributor parameters, and associated model coefficients. The model coefficients are fitted based on the setup data, and the placement metric determined from the fitted model coefficients.