公开(公告)号：US20220390850A1

公开(公告)日：2022-12-08

申请号：US17775361

申请日：2020-10-16

Applicant: ASML NETHERLANDS B.V.

Inventor： Ruud Antonius Catharina Maria BEERENS ,  Koen Gerhardus WINKELS ,  Dirk Willem HARBERTS ,  Lucas Henricus Johannes STEVENS ,  Dennis Dominic VAN DER VOORT ,  Edwin Johannes Cornelis BOS ,  George Alois Leonie LEENKNEGT ,  Nicolaas TEN KATE

IPC: G03F7/20 ,  H01L21/687 ,  H01L21/67

Abstract: A substrate support is configured to support a substrate. The substrate support comprises a plurality of burls protruding from a base surface of the substrate support. The burls have distal ends in a plane for supporting a lower surface of the substrate with a gap between the base surface of the substrate support and the lower surface of the substrate. The substrate support comprises a liquid supply channel for supplying a conductive liquid to the gap so as to bridge the gap between the base surface of the substrate support and the lower surface of the substrate, thereby allowing charge to pass between the substrate support and the substrate. The substrate support has a controlled electrical potential such that charge distribution at the lower surface of the substrate can be manipulated.

公开(公告)号：US20230095108A1

公开(公告)日：2023-03-30

申请号：US17911498

申请日：2021-03-03

Applicant: ASML NETHERLANDS B.V.

Inventor： Dennis Dominic VAN DER VOORT ,  Nicolaas TEN KATE

IPC: G03F7/20

Abstract: A method for preparing a substrate for an exposure process of a lithographic manufacturing method, the method including imposing different local temperatures across the substrate so as to induce different thermal expansion across the substrate before the exposure process. This method is for compensating for deformation of the substrate induced when the substrate is positioned on a substrate table of a lithographic apparatus. There is also provided a local temperature applicator to implement this technique and to a lithographic apparatus including such a local temperature applicator.

公开(公告)号：US20230290665A1

公开(公告)日：2023-09-14

申请号：US18024042

申请日：2021-08-10

Applicant: ASML NETHERLANDS B.V.

Inventor： Gosse Charles DE VRIES ,  Dennis Dominic VAN DER VOORT

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6835 ,  H01L21/68757

Abstract: A base plate configured to be attached to a semiconductor substrate, wherein the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and the base plate is made from a material having a Young's modulus larger than 300 GPa.