SEM FOV fingerprint in stochastic EPE and placement measurements in large FOV SEM devices

    公开(公告)号:US11435671B2

    公开(公告)日:2022-09-06

    申请号:US16690633

    申请日:2019-11-21

    Inventor: Marleen Kooiman

    Abstract: A method of reducing variability of an error associated with a structure on a substrate in a lithography process is disclosed. The method includes determining, based on one or more images obtained based on a scan of the substrate by a scanning electron microscope (SEM), a first error due to a SEM distortion in the image. The method also includes determining, based on the image, a second error associated with a real error of the structure, where the error associated with the structure includes the first error and the second error. A command is generated by a data processor that enables a modification of the lithography process and an associated reduction of the variability of the error based on reducing any of the first error or the second error.

    Method for controlling a manufacturing apparatus and associated apparatuses

    公开(公告)号:US11016399B2

    公开(公告)日:2021-05-25

    申请号:US16765595

    申请日:2018-12-10

    Abstract: A method of predicting the dominant failure mode and/or the failure rate of a plurality of features formed on a substrate, and an associated inspection apparatus. The method may include determining a placement metric for each feature, the placement metric including a measure of whether the feature is in an expected position, and comparing a distribution of the placement metric to a reference (e.g., Gaussian) distribution. The placement metric may include a boundary metric for a plurality of boundary points on a boundary defining each feature, the boundary metric including a measure of whether a boundary point is in an expected position. The dominant failure mode and/or the failure rate of the plurality of features is predicted from the comparison.

    Systems and methods for reducing resist model prediction errors

    公开(公告)号:US11966167B2

    公开(公告)日:2024-04-23

    申请号:US16771343

    申请日:2018-12-20

    CPC classification number: G03F7/705 G03F7/70666 G03F7/706839

    Abstract: A method for calibrating a resist model. The method includes: generating a modeled resist contour of a resist structure based on a simulated aerial image of the resist structure and parameters of the resist model, and predicting a metrology contour of the resist structure from the modeled resist contour based on information of an actual resist structure obtained by a metrology device. The method includes adjusting one or more of the parameters of the resist model based on a comparison of the predicted metrology contour and an actual metrology contour of the actual resist structure obtained by the metrology device.

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