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公开(公告)号:US20240319123A1
公开(公告)日:2024-09-26
申请号:US18691828
申请日:2022-08-16
Applicant: ASML Netherlands B.V.
Inventor: Achim WOESSNER , Younghoon SONG , Pioter NIKOLSKI , Yun A SUNG , Antonio CORRADI , Hermanus Adrianus DILLEN
IPC: G01N23/2251
CPC classification number: G01N23/2251 , G01N2223/304 , G01N2223/306 , G01N2223/401 , G01N2223/418 , G01N2223/6116 , G01N2223/646
Abstract: Apparatuses, systems, and methods for providing beams for classifying and identifying failure mechanisms associated with a sample of charged particle beam systems. In some embodiments, a method may include analyzing a first plurality of voltage contrast images of a sample to identify a plurality of defects; and analyzing a pattern of a subset of the plurality of defects to determine a failure mechanism for the subset of the plurality of defects.
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公开(公告)号:US20230161265A1
公开(公告)日:2023-05-25
申请号:US18157776
申请日:2023-01-20
Applicant: ASML Netherlands B.V.
Inventor: Pioter NIKOLSKI , Thomas THEEUWES , Antonio CORRADI , Duan-Fu Stephen HSU , Sun Wook JUNG
IPC: G03F7/20
CPC classification number: G03F7/70525 , G03F7/70616 , G03F7/70441
Abstract: Disclosed is a method of determining a process window within a process space comprising obtaining contour data relating to features to be provided to a substrate across a plurality of layers, for each of a plurality of process conditions associated with providing the features across said plurality of layers and failure mode data describing constraints on the contour data across the plurality of layers. The failure mode data is applied to the contour data to determine a failure count for each process condition; and the process window is determined by associating each process condition to its corresponding failure count. Also disclosed is a method of determining an actuation constrained subspace of the process window based on actuation constraints imposed by the plurality of actuators.
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公开(公告)号:US20240004307A1
公开(公告)日:2024-01-04
申请号:US18039484
申请日:2021-11-29
Applicant: ASML NETHERLANDS B.V.
Inventor: Pioter NIKOLSKI , Rick Jeroen MEIJERINK
IPC: G03F7/00
CPC classification number: G03F7/706 , G03F7/70575
Abstract: A method of forming a pattern on a substrate using a lithographic apparatus provided with a patterning device and a projection system having chromatic aberrations, the method including: providing a radiation beam having a plurality of wavelength components to the patterning device; forming an image of the patterning device on the substrate using the projection system to form the pattern, wherein a position of the pattern is dependent on a wavelength of the radiation beam due to the chromatic aberrations; and controlling a spectrum of the radiation beam to control the position of the pattern.
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公开(公告)号:US20220327364A1
公开(公告)日:2022-10-13
申请号:US17638472
申请日:2020-07-31
Applicant: ASML NETHERLANDS B.V.
Inventor: Stefan HUNSCHE , Fuming WANG , Ya LUO , Pioter NIKOLSKI
Abstract: Systems and methods for predicting substrate geometry associated with a patterning process are described. Input information including geometry information and/or process information for a pattern is received and, using a machine learning prediction model, multi-dimensional output substrate geometry is predicted. The multi-dimensional output information may include pattern probability images. A stochastic edge placement error band and/or a stochastic failure rate may be predicted. The input information can include simulated aerial images, simulated resist images, target substrate dimensions, and/or data from a lithography apparatus associated with device manufacturing. Different aerial images may correspond to different heights in resist layers associated with the patterning process, for example.
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