公开(公告)号：US20230341783A1

公开(公告)日：2023-10-26

申请号：US17796434

申请日：2021-01-19

Applicant: ASML NETHERLANDS B.V.

Inventor： Arnaud HUBAUX ,  Patrick WARNAAR ,  Scott Anderson MIDDLEBROOKS ,  Tijmen Pieter COLLIGNON ,  Chung-Hsun LI ,  Georgios TSIROGIANNIS ,  Sayyed Mojtaba SHAKERI

IPC: G03F7/00

CPC classification number: G03F7/705 ,  G03F7/70458 ,  G03F7/70633

Abstract: A method of determining matching performance between tools used in semiconductor manufacture and associated tools is described. The method includes obtaining a plurality of data sets related to a plurality of tools and a representation of the data sets in a reduced space having a reduced dimensionality. A matching metric and/or matching correction is determined based on matching the reduced data sets in the reduced space.

公开(公告)号：US20230341784A1

公开(公告)日：2023-10-26

申请号：US18016811

申请日：2021-07-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Tijmen Pieter COLLIGNON ,  Pavel SMAL ,  Cyrus Emil TABERY ,  Thiago DOS SANTOS GUZELLA ,  Vahid BASTANI

IPC: G03F7/00 ,  G03F9/00

CPC classification number: G03F7/70508 ,  G03F9/7034 ,  G03F9/7026 ,  G03F7/70908 ,  G03F7/70516

Abstract: Methods and associated apparatus for identifying contamination in a semiconductor fab. The methods include determining contamination map data for a plurality of semiconductor wafers clamped to a wafer table after being processed in the semiconductor fab. Combined contamination map data is determined based, at least in part, on a combination of the contamination map data of the plurality of semiconductor wafers. The combined contamination map data is combined to reference data. The reference data include one or more values for the combined contamination map data that are indicative of contamination in one or more tools in the semiconductor fab.