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公开(公告)号:US11520238B2
公开(公告)日:2022-12-06
申请号:US17479078
申请日:2021-09-20
Applicant: ASML NETHERLANDS B.V.
Inventor: Jelle Nije , Alexander Ypma , Dimitra Gkorou , Georgios Tsirogiannis , Robert Jan Van Wijk , Tzu-Chao Chen , Frans Reinier Spiering , Sarathi Roy , Cédric Désiré Grouwstra
IPC: G03F7/20
Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.
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2.
公开(公告)号:US11803127B2
公开(公告)日:2023-10-31
申请号:US17295193
申请日:2019-11-04
Applicant: ASML NETHERLANDS B.V.
Inventor: Chenxi Lin , Cyrus Emil Tabery , Hakki Ergün Cekli , Simon Philip Spencer Hastings , Boris Menchtchikov , Yi Zou , Yana Cheng , Maxime Philippe Frederic Genin , Tzu-Chao Chen , Davit Harutyunyan , Youping Zhang
IPC: G03F7/00 , G05B13/02 , G05B19/418 , H01L21/66
CPC classification number: G03F7/705 , G05B13/027 , G05B19/41875 , H01L22/20 , G05B2219/32193 , G05B2219/32368 , G05B2219/45031
Abstract: A method for determining a root cause affecting yield in a process for manufacturing devices on a substrate, the method including: obtaining yield distribution data including a distribution of a yield parameter across the substrate or part thereof; obtaining sets of metrology data, each set including a spatial variation of a process parameter over the substrate or part thereof corresponding to a different layer of the substrate; comparing the yield distribution data and metrology data based on a similarity metric describing a spatial similarity between the yield distribution data and an individual set out of the sets of the metrology data; and determining a first similar set of metrology data out of the sets of metrology data, being the first set of metrology data in terms of processing order for the corresponding layers, which is determined to be similar to the yield distribution data.
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公开(公告)号:US11150562B2
公开(公告)日:2021-10-19
申请号:US16486859
申请日:2018-02-22
Applicant: ASML NETHERLANDS B.V.
Inventor: Jelle Nije , Alexander Ypma , Dimitra Gkorou , Georgios Tsirogiannis , Robert Jan Van Wijk , Tzu-Chao Chen , Frans Reinier Spiering , Sarathi Roy , Cédric Désiré Grouwstra
IPC: G03F7/20
Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.
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