公开(公告)号：JP2009033147A

公开(公告)日：2009-02-12

申请号：JP2008169180

申请日：2008-06-27

Applicant: Asml Netherlands Bv ,  エーエスエムエル ネザーランズ ビー.ブイ.

Inventor： WONG PATRICK ,  GEHOEL-VAN ANSEM WENDY FRANSIS ,  MAAS RUDOLF ADRIANUS JOANNES ,  WANG SUPING

IPC: H01L21/027

CPC classification number: G03F7/168 ,  G03F7/091 ,  G03F7/11 ,  G03F7/2041

Abstract: PROBLEM TO BE SOLVED: To provide a method for processing a substrate capable of removing or mitigating one or a plurality of problems, and a method for manufacturing a device.
SOLUTION: The method for processing a substrate provided with an anti-reflective coating extending to or beyond a peripheral edge of the substrate, includes a step of removing a portion of the anti-reflective coating 2 adjacent to and around a periphery of the substrate W using a back-side removal process, a step of depositing a layer of radiation sensitive material onto the anti-reflective coating, a step of depositing a top-coat layer onto the layer of radiation sensitive material, and a step of simultaneously removing a portion of the layer of radiation sensitive material and a portion of the top-coat layer from around an area adjacent to the periphery of the substrate by using the top-side removing process.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 解决的问题：提供一种处理能够去除或减轻一个或多个问题的基板的方法及其制造方法。 解决方案：用于处理设置有延伸到或超过衬底的周边边缘的抗反射涂层的衬底的方法包括以下步骤：除去邻近于和围绕衬底周围的防反射涂层2的一部分 使用背面去除工艺的衬底W，在抗反射涂层上沉积辐射敏感材料层的步骤，将顶涂层沉积在辐射敏感材料层上的步骤，以及同时 通过使用顶侧去除工艺，从邻近基板周围的区域周围除去辐射敏感材料层的一部分和顶涂层的一部分。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：NL1035608A1

公开(公告)日：2009-01-12

申请号：NL1035608

申请日：2008-06-23

Applicant: ASML NETHERLANDS BV

Inventor： WONG PATRICK ,  ANSEM WENDY FRANSISCA JOHANNA GEHOEL VAN ,  MAAS RUDOLF ADRIANUS JOANNES ,  WANG SUPING

IPC: H01L21/027 ,  H01L21/304