Abstract:
PROBLEM TO BE SOLVED: To provide a substrate for reducing a contamination source to be used for a lithography projection device. SOLUTION: The substrate W comprises a sealing coating 106 covering at least part of a first interface between two layers 100, 102 on the substrate or between each layer and the substrate without extending to a central portion of the substrate. The sealing coating is used for providing the substrate which is used for the lithography projection device for reducing a risk of contaminating one or more components of immersion liquid and a lithography device, and a device manufacturing method. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a dispenser system for small amount of resist which can reduce contamination and/or defects of patterns. SOLUTION: A dispenser for small amount of resist includes a pressure operated valve capable of reverse aspiration which can be connected with a controller output portion which opens and closes a valve to control supply of liquid to a nozzle of a spin coater and the spin coater, wherein the dispenser comprises a holder for a bottle for pressurizing fluid in the bottle by applying gas pressure. The dispenser is suitable for using with a bottle which is filled with 100 ml to 300 ml of resist sample in advance. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To achieve a double patterning process for printing dense lines by which adverse effects after first pattering and before second patterning are mitigated. SOLUTION: In a first processing, a first semi-dense pattern of lines is printed in a first resist layer superimposed on a substrate with bottom anti-reflection coating applied. In a second processing, a second semi-dense pattern of lines is printed in a second resist layer provided over a cleared region. The first and the second semi-dense line patterns are positioned at an alternate position, and provide a desired dense pattern of lines and spaces. After development of a first resist, but before providing a second resist on the substrate, a surface conditioning of the bottom anti-reflection coating is applied to the cleared region between lines of a first resist material. A surface conditioning step improves adhesion of a feature of the second resist to a surface of the cleared region. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for processing a substrate capable of removing or mitigating one or a plurality of problems, and a method for manufacturing a device. SOLUTION: The method for processing a substrate provided with an anti-reflective coating extending to or beyond a peripheral edge of the substrate, includes a step of removing a portion of the anti-reflective coating 2 adjacent to and around a periphery of the substrate W using a back-side removal process, a step of depositing a layer of radiation sensitive material onto the anti-reflective coating, a step of depositing a top-coat layer onto the layer of radiation sensitive material, and a step of simultaneously removing a portion of the layer of radiation sensitive material and a portion of the top-coat layer from around an area adjacent to the periphery of the substrate by using the top-side removing process. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an immersion lithography device by which track processing is simplified, and the size uniformity of relatively thin line width is improved. SOLUTION: An immersion liquid contains one or several photosensitive materials. The one or several photosensitive materials are exposed to a radiation beam, thereby photochemically activated, and deposited on a surface of a substrate as a film. The film is deposited only in an area irradiated with light only when the photosensitive materials are activated. Therefore, a patterned radiation beam is irradiated, thereby a patterned film 17 is established on the surface of a substrate W according to the pattern. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
Method of Preparing a Substrate for Lithography, a Substrate a Device Manufacturing Method, a Sealing Coating Applicator and a Sealing Coating Measurement Apparatus A substrate for use in a lithographic projection apparatus. The substrate includes a sealing coating that covers at least a part of a first interface between two layers on the substrate, or between a layer and the substrate, and does not extend to a central portion of the substrate.