METHOD FOR CONTROLLING A MANUFACTURING PROCESS AND ASSOCIATED APPARATUSES

    公开(公告)号:EP3869271A1

    公开(公告)日:2021-08-25

    申请号:EP20158387.9

    申请日:2020-02-20

    Abstract: Disclosed is a method and associated apparatuses for controlling a process of manufacturing semiconductor devices on a substrate. The method comprises obtaining process data relating to the process and determining a correction for the process based on the data and a first control objective associated with the devices on the substrate. A first probability of the first control objective being achievable is determined and the correction adjusted based on said probability and at least a second control objective having a second probability of being achievable compared to the first control objective.

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