公开(公告)号：MY133337A

公开(公告)日：2007-11-30

申请号：MYPI20034568

申请日：2003-11-28

Applicant: ATOFINA CHEM INC

Inventor： NOSOWITZ MARTIN ,  CARROLL GLENN ,  MARTYAK NICHOLAS M ,  JANNEY PATRICK K

IPC: H01L21/44 ,  C09G1/02 ,  H01L21/321

Abstract: A FAMILY OF SLURRIES ARE DISCLOSED WHICH ARE USEFUL IN MODIFYING EXPOSED SURFACES OF WAFERS FOR SEMICONDUCTOR FABRICATION ARE PROVIDED ALONG WITH METHODS OF MODIFYING EXPOSED SURFACES OF WAFERS FOR SEMICONDUCTOR FABRICATION UTILIZING SUCH A FAMILY OF WORKING SLURRIES, AND SEMICONDUCTOR WAFERS. THE SLURRIES OF THE INVENTION ARE COMPRISED OF A LIQUID CARRIER;A SULFUR-BEARING COMPOUNDS CAPABLE OF CONVERTING COPPER TO COPPER SULFIDE; OPTIONALLY , ABRASIVE PARTICLES (POLISHING AGENT; OPTIONALLY A CHELATING AGENT; OPTIONALLY A BUFFERING AGENT; OPTIONALLY, A STOPPING COMPOUND; OPTIONALLY, OTHER ADDITIVES; AND OPTIONALLY,A CO-SOLVENT. THE METHOD OF THE INVENTION COMPRISES THE STEPS F : A) PROVIDING A WAFER COMPRISING A FIRST MATERIAL HAVING A SURFACE ETCHED TO FORM A PATTERN AND A SECOND MATERIAL DEPOSITED OVER THE SURFACE OF THE FIRST MATERIAL; B) CONTACTING THE SECOND MATERIAL OF THE WAFER WITH ABRASIVE IN THE PRESENCE OF THE WORKING SLURRY; AND C) RELATIVELY MOVING THE WAFER OR POLISHING PAD OR BOTH WHILE THE SECOND MATERIAL IS IN CONTACT WITH THE SLURRY AND ABRASIVE PARTICLES UNTIL AN EXPOSED SURFACE OF THE WAFER IS PLANAR AN COMPRISES AT LEAST ONE AREA OF EXPOSED FIRST MATERIAL AND ONE AREA OF EXPOSED SECOND MATERIAL.

公开(公告)号：AU2003302769A1

公开(公告)日：2004-07-09

申请号：AU2003302769

申请日：2003-11-19

Applicant: ATOFINA CHEM INC

Inventor： CARROLL GLENN ,  JANNEY PATRICK K ,  NOSOWITZ MARTIN ,  MARTYAK NICHOLAS M

IPC: C09G1/02 ,  H01L21/321