公开(公告)号：AT376254T

公开(公告)日：2007-11-15

申请号：AT00900602

申请日：2000-01-18

Applicant: AXALTO SA

Inventor： REIGNOUX YVES ,  DANIEL ERIC

IPC: B42D15/10 ,  H01L23/498 ,  G06K19/077 ,  H01L21/02 ,  H01L23/02 ,  H01L23/04 ,  H01L23/31 ,  H01L23/538

Abstract: This invention relates to an integrated circuit device, in particular for manufacturing smart card electronic units for smart cards. It comprises: an active layer ( 32 ) including a semiconductor material within which integrated circuits are formed and having a face ( 34 ) provided with a plurality of electrical connection terminals ( 36 ) and a second face, wherein said face has a thickness smaller than 100 mum, and a complementary layer ( 40 ) having a first face ( 42 ) attached to the active face of the active layer, a second face ( 44 ) and a side surface ( 48 ), wherein said complementary layer includes a plurality of recesses ( 46 ), each recess extending through the whole thickness of the complementary layer, and extending from a contact terminal ( 36 ) to said side surface ( 48 ).

公开(公告)号：DE60036784T2

公开(公告)日：2008-07-24

申请号：DE60036784

申请日：2000-01-18

Applicant: AXALTO SA

Inventor： REIGNOUX YVES ,  DANIEL ERIC

IPC: B42D15/10 ,  H01L23/498 ,  G06K19/077 ,  H01L21/02 ,  H01L23/02 ,  H01L23/04 ,  H01L23/31 ,  H01L23/538

Abstract: This invention relates to an integrated circuit device, in particular for manufacturing smart card electronic units for smart cards. It comprises: an active layer ( 32 ) including a semiconductor material within which integrated circuits are formed and having a face ( 34 ) provided with a plurality of electrical connection terminals ( 36 ) and a second face, wherein said face has a thickness smaller than 100 mum, and a complementary layer ( 40 ) having a first face ( 42 ) attached to the active face of the active layer, a second face ( 44 ) and a side surface ( 48 ), wherein said complementary layer includes a plurality of recesses ( 46 ), each recess extending through the whole thickness of the complementary layer, and extending from a contact terminal ( 36 ) to said side surface ( 48 ).

公开(公告)号：ES2293891T3

公开(公告)日：2008-04-01

申请号：ES00900602

申请日：2000-01-18

Applicant: AXALTO SA

Inventor： REIGNOUX YVES ,  DANIEL ERIC

IPC: B42D15/10 ,  H01L23/498 ,  G06K19/077 ,  H01L21/02 ,  H01L23/02 ,  H01L23/04 ,  H01L23/31 ,  H01L23/538

Abstract: Dispositivo con circuitos integrados provisto de: - una pastilla semiconductora (32) que forma una capa activa donde se realizan los circuitos integrados. La pastilla semiconductora tiene una cara activa (34) provista de varios bornes de conexión eléctrica (36) y una segunda cara (38), y - - una capa adicional (40) que tiene una primera cara (42) fijada en la cara activa (34) de la pastilla semiconductora (32), una segunda cara (44) y una superficie lateral (48) que delimita el perímetro de la capa adicional, - caracterizado porque: - el espesor de la pastilla semiconductora (32) es inferior a 100 µm, - la capa adicional (40) tiene tantos orificios (46) dentados vistos en planos como bornes de contacto en la pastilla semiconductora, extendiéndose cada orificio por todo el espesor de la capa adicional (40), de un borne de contacto (36) a la susodicha superficie lateral (48), - la capa adicional (40) cubre la totalidad de la cara activa (34) de la pastilla semiconductora, excepto los orificios (46) dentados vistos en planos, - y porque - el espesor de la capa adicional (40) es superior al de la pastilla semiconductora (32).

公开(公告)号：DE60036784D1

公开(公告)日：2007-11-29

申请号：DE60036784

申请日：2000-01-18

Applicant: AXALTO SA

Inventor： REIGNOUX YVES ,  DANIEL ERIC

IPC: B42D15/10 ,  H01L23/498 ,  G06K19/077 ,  H01L21/02 ,  H01L23/02 ,  H01L23/04 ,  H01L23/31 ,  H01L23/538

Abstract: This invention relates to an integrated circuit device, in particular for manufacturing smart card electronic units for smart cards. It comprises: an active layer ( 32 ) including a semiconductor material within which integrated circuits are formed and having a face ( 34 ) provided with a plurality of electrical connection terminals ( 36 ) and a second face, wherein said face has a thickness smaller than 100 mum, and a complementary layer ( 40 ) having a first face ( 42 ) attached to the active face of the active layer, a second face ( 44 ) and a side surface ( 48 ), wherein said complementary layer includes a plurality of recesses ( 46 ), each recess extending through the whole thickness of the complementary layer, and extending from a contact terminal ( 36 ) to said side surface ( 48 ).