公开(公告)号：DE60036784T2

公开(公告)日：2008-07-24

申请号：DE60036784

申请日：2000-01-18

Applicant: AXALTO SA

Inventor： REIGNOUX YVES ,  DANIEL ERIC

IPC: B42D15/10 ,  H01L23/498 ,  G06K19/077 ,  H01L21/02 ,  H01L23/02 ,  H01L23/04 ,  H01L23/31 ,  H01L23/538

Abstract: This invention relates to an integrated circuit device, in particular for manufacturing smart card electronic units for smart cards. It comprises: an active layer ( 32 ) including a semiconductor material within which integrated circuits are formed and having a face ( 34 ) provided with a plurality of electrical connection terminals ( 36 ) and a second face, wherein said face has a thickness smaller than 100 mum, and a complementary layer ( 40 ) having a first face ( 42 ) attached to the active face of the active layer, a second face ( 44 ) and a side surface ( 48 ), wherein said complementary layer includes a plurality of recesses ( 46 ), each recess extending through the whole thickness of the complementary layer, and extending from a contact terminal ( 36 ) to said side surface ( 48 ).

公开(公告)号：DE60116378D1

公开(公告)日：2006-02-02

申请号：DE60116378

申请日：2001-11-19

Applicant: AXALTO SA

Inventor： BILLEBAUD PASCAL ,  REIGNOUX YVES

IPC: G06K19/077

Abstract: The invention concerns an electronic data storage medium including a body ( 30 ) made from insulated plastic material which has two main parallel sides, a semiconductor component ( 34 ) and a number of external electrical contact pads flush with the first main side ( 30 a) of the body. The body ( 30 ) includes a recess ( 32 ) opening out onto the first main side ( 30 a). The storage medium also includes a number of conducting elements ( 28 ), each with a first end (a) flush with the first main side to form an external contact pad, a second end (b) arranged in the said recess and an intermediate part (c) buried in the body; and A number of connecting elements ( 38 ) to electrically connect the terminals of the semiconductor component to the second ends of the conducting elements.

公开(公告)号：DE60116378T2

公开(公告)日：2006-08-24

申请号：DE60116378

申请日：2001-11-19

Applicant: AXALTO SA

Inventor： BILLEBAUD PASCAL ,  REIGNOUX YVES

IPC: G06K19/077

Abstract: The invention concerns an electronic data storage medium including a body ( 30 ) made from insulated plastic material which has two main parallel sides, a semiconductor component ( 34 ) and a number of external electrical contact pads flush with the first main side ( 30 a) of the body. The body ( 30 ) includes a recess ( 32 ) opening out onto the first main side ( 30 a). The storage medium also includes a number of conducting elements ( 28 ), each with a first end (a) flush with the first main side to form an external contact pad, a second end (b) arranged in the said recess and an intermediate part (c) buried in the body; and A number of connecting elements ( 38 ) to electrically connect the terminals of the semiconductor component to the second ends of the conducting elements.

公开(公告)号：AT328287T

公开(公告)日：2006-06-15

申请号：AT99402687

申请日：1999-10-28

Applicant: AXALTO SA

Inventor： REIGNOUX YVES ,  LIMELETTE YANN

IPC: G01R31/04 ,  G01N3/20 ,  G06K19/077

公开(公告)号：AT314700T

公开(公告)日：2006-01-15

申请号：AT01983732

申请日：2001-11-19

Applicant: AXALTO SA

Inventor： BILLEBAUD PASCAL ,  REIGNOUX YVES

IPC: G06K19/077

Abstract: The invention concerns an electronic data storage medium including a body ( 30 ) made from insulated plastic material which has two main parallel sides, a semiconductor component ( 34 ) and a number of external electrical contact pads flush with the first main side ( 30 a) of the body. The body ( 30 ) includes a recess ( 32 ) opening out onto the first main side ( 30 a). The storage medium also includes a number of conducting elements ( 28 ), each with a first end (a) flush with the first main side to form an external contact pad, a second end (b) arranged in the said recess and an intermediate part (c) buried in the body; and A number of connecting elements ( 38 ) to electrically connect the terminals of the semiconductor component to the second ends of the conducting elements.

公开(公告)号：EP1797527A4

公开(公告)日：2008-02-13

申请号：EP05754612

申请日：2005-06-20

Applicant: AXALTO SA

Inventor： REIGNOUX YVES ,  NEROT DOROTHEE ,  ROUSSEL FRANCOIS

IPC: G06K19/077 ,  G06K13/067

CPC classification number: G06K19/07739 ,  G06K13/067 ,  G06K19/077 ,  G06K19/07743

Abstract: The chip card comprises a card body (24) and an embedded chip module (14) having a plurality of contact fields (C1-C8) connected to respective terminals of the chip. The card body further comprises a positioning feature (28) adapted to univocally identify said contact fields according to their location and orientation on the card body. The positioning feature is a hole or a notch formed on the card body in an area including the chip module such as a contact field (C1-C8) which has no electrical functionality as contact field C6 according to ISO 7816-2. The invention is particularly adapted to card bodies including a plug-in removable portion of smaller size comprising said chip module and said positioning feature such as smaller size 'mini-plug' SIMs for mobile phones.

Abstract translation: 芯片卡包括具有连接到芯片的各个端子的多个接触场（C1-C8）的卡体（24）和嵌入式芯片模块（14）。 卡体还包括定位特征（28），其适于根据它们在卡体上的位置和取向来单一地识别所述接触场。 定位特征是在包括芯片模块的区域中的卡体上形成的孔或凹口，例如根据ISO 7816-2的不具有作为接触区域C6的电气功能的接触场（C1-C8）。 本发明特别适用于包括较小尺寸的插入式可拆卸部分的卡体，包括所述芯片模块和所述定位特征，例如用于移动电话的较小尺寸的“小型插头”SIM卡。

公开(公告)号：AT376254T

公开(公告)日：2007-11-15

申请号：AT00900602

申请日：2000-01-18

Applicant: AXALTO SA

Inventor： REIGNOUX YVES ,  DANIEL ERIC

IPC: B42D15/10 ,  H01L23/498 ,  G06K19/077 ,  H01L21/02 ,  H01L23/02 ,  H01L23/04 ,  H01L23/31 ,  H01L23/538

Abstract: This invention relates to an integrated circuit device, in particular for manufacturing smart card electronic units for smart cards. It comprises: an active layer ( 32 ) including a semiconductor material within which integrated circuits are formed and having a face ( 34 ) provided with a plurality of electrical connection terminals ( 36 ) and a second face, wherein said face has a thickness smaller than 100 mum, and a complementary layer ( 40 ) having a first face ( 42 ) attached to the active face of the active layer, a second face ( 44 ) and a side surface ( 48 ), wherein said complementary layer includes a plurality of recesses ( 46 ), each recess extending through the whole thickness of the complementary layer, and extending from a contact terminal ( 36 ) to said side surface ( 48 ).

公开(公告)号：DE69931575T2

公开(公告)日：2007-05-10

申请号：DE69931575

申请日：1999-10-28

Applicant: AXALTO SA

Inventor： REIGNOUX YVES ,  LIMELETTE YANN

IPC: G01R31/04 ,  G01N3/20 ,  G06K19/077

公开(公告)号：ES2293891T3

公开(公告)日：2008-04-01

申请号：ES00900602

申请日：2000-01-18

Applicant: AXALTO SA

Inventor： REIGNOUX YVES ,  DANIEL ERIC

IPC: B42D15/10 ,  H01L23/498 ,  G06K19/077 ,  H01L21/02 ,  H01L23/02 ,  H01L23/04 ,  H01L23/31 ,  H01L23/538

Abstract: Dispositivo con circuitos integrados provisto de: - una pastilla semiconductora (32) que forma una capa activa donde se realizan los circuitos integrados. La pastilla semiconductora tiene una cara activa (34) provista de varios bornes de conexión eléctrica (36) y una segunda cara (38), y - - una capa adicional (40) que tiene una primera cara (42) fijada en la cara activa (34) de la pastilla semiconductora (32), una segunda cara (44) y una superficie lateral (48) que delimita el perímetro de la capa adicional, - caracterizado porque: - el espesor de la pastilla semiconductora (32) es inferior a 100 µm, - la capa adicional (40) tiene tantos orificios (46) dentados vistos en planos como bornes de contacto en la pastilla semiconductora, extendiéndose cada orificio por todo el espesor de la capa adicional (40), de un borne de contacto (36) a la susodicha superficie lateral (48), - la capa adicional (40) cubre la totalidad de la cara activa (34) de la pastilla semiconductora, excepto los orificios (46) dentados vistos en planos, - y porque - el espesor de la capa adicional (40) es superior al de la pastilla semiconductora (32).

公开(公告)号：DE69931575D1

公开(公告)日：2006-07-06

申请号：DE69931575

申请日：1999-10-28

Applicant: AXALTO SA

Inventor： REIGNOUX YVES ,  LIMELETTE YANN

IPC: G01R31/04 ,  G01N3/20 ,  G06K19/077