公开(公告)号：WO2008068163A3

公开(公告)日：2008-09-12

申请号：PCT/EP2007062863

申请日：2007-11-27

Applicant: AXALTO SA ,  NEROT DOROTHEE ,  FORTEL JULIEN ,  THUILLARD SANDRINE ,  LAKNIN MOURAD

Inventor： NEROT DOROTHEE ,  FORTEL JULIEN ,  THUILLARD SANDRINE ,  LAKNIN MOURAD

IPC: G06K19/077 ,  H01L23/498 ,  H05K3/24

CPC classification number: H01L23/49855 ,  H01L23/60 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K1/0393 ,  H05K3/0097 ,  H05K3/242 ,  H05K2201/09354 ,  H05K2203/1545 ,  H01L2924/00

Abstract: A base film for modules of electronic devices, said base film including a linear film having on its sides at least one metal outer rail and patterns (5) of contact pads (9) arranged on the film, each pattern corresponding to a module. It is characterized in that a single contact pad (17) of each pattern (9) is linked to at least one rail (13, 15) by at least one metal track (19, 27). The invention also relates to a module producing method using the obtained base film and module.

Abstract translation: 一种用于电子器件模块的基膜，所述基膜包括线侧膜，其侧面至少有一个金属外轨和布置在膜上的接触焊盘（9）的图案（5），每个图案对应于模块。 其特征在于，每个图案（9）的单个接触垫（17）通过至少一个金属轨道（19,27）连接到至少一个轨道（13,15）。 本发明还涉及使用所获得的基膜和模块的模块制造方法。

公开(公告)号：EP1797527A4

公开(公告)日：2008-02-13

申请号：EP05754612

申请日：2005-06-20

Applicant: AXALTO SA

Inventor： REIGNOUX YVES ,  NEROT DOROTHEE ,  ROUSSEL FRANCOIS

IPC: G06K19/077 ,  G06K13/067

CPC classification number: G06K19/07739 ,  G06K13/067 ,  G06K19/077 ,  G06K19/07743

Abstract: The chip card comprises a card body (24) and an embedded chip module (14) having a plurality of contact fields (C1-C8) connected to respective terminals of the chip. The card body further comprises a positioning feature (28) adapted to univocally identify said contact fields according to their location and orientation on the card body. The positioning feature is a hole or a notch formed on the card body in an area including the chip module such as a contact field (C1-C8) which has no electrical functionality as contact field C6 according to ISO 7816-2. The invention is particularly adapted to card bodies including a plug-in removable portion of smaller size comprising said chip module and said positioning feature such as smaller size 'mini-plug' SIMs for mobile phones.

Abstract translation: 芯片卡包括具有连接到芯片的各个端子的多个接触场（C1-C8）的卡体（24）和嵌入式芯片模块（14）。 卡体还包括定位特征（28），其适于根据它们在卡体上的位置和取向来单一地识别所述接触场。 定位特征是在包括芯片模块的区域中的卡体上形成的孔或凹口，例如根据ISO 7816-2的不具有作为接触区域C6的电气功能的接触场（C1-C8）。 本发明特别适用于包括较小尺寸的插入式可拆卸部分的卡体，包括所述芯片模块和所述定位特征，例如用于移动电话的较小尺寸的“小型插头”SIM卡。