Mems singulation process utilizing protective coating

    公开(公告)号:AU2002251828A1

    公开(公告)日:2002-08-12

    申请号:AU2002251828

    申请日:2002-01-22

    Applicant: AXSUN TECH INC

    Abstract: A process for singulating MOEMS optical devices from a precursor structure, in which the precursor structure comprises device material, having movable optical structures, and handle material, through which optical ports are formed to provide for optical access to the movable optical structures. The process comprises coating a frontside and a backside of the precursor structure with protection material. The precursor structure is then attached to a substrate such as dicing tape and the precursor structure separated into individual optical devices by a process, including die sawing. Thereafter, the optical devices are removed from the tape and the protection material removed from the optical devices.

    MEMS SINGULATION PROCESS UTILIZING PROTECTIVE COATING
    2.
    发明申请
    MEMS SINGULATION PROCESS UTILIZING PROTECTIVE COATING 审中-公开
    使用保护涂层的MEMS整合工艺

    公开(公告)号:WO02060811A2

    公开(公告)日:2002-08-08

    申请号:PCT/US0202348

    申请日:2002-01-22

    CPC classification number: H01L21/67132 B81C1/00896 G02B26/0841 H01L21/67092

    Abstract: A process for singulating MOEMS optical devices (10) from a precursor structure (110), in which the precursor structure (110) comprises device material (12), having movable optical structures (14), and handle material (22), through which optical ports (30) are formed to provide for optical access to the movable optical structures (14). The process comprises coating a frontside and a backside of the precursor structure (110) with protection material (610). The precursor structure (110) is then attached to a substrate such as dicing tape and the precursor structure (110) separated into individual optical devices (10) by a process, including die sawing. Thereafter, the optical devices (10) are removed from the tape and the protection material (610) removed from the optical devices (10).

    Abstract translation: 一种用于从前体结构(110)分离MOEMS光学器件(10)的方法,其中前体结构(110)包括器件材料(12),具有可移动的光学结构(14)和手柄材料(22) 光端口(30)被形成为提供对可移动光学结构(14)的光学访问。 该方法包括用保护材料(610)涂覆前体结构(110)的前侧和后侧。 然后,前体结构(110)通过包括模切法的工艺被连接到诸如切割带的基底上,并将前体结构(110)分离成各个光学器件(10)。 此后,将光学装置(10)从带上取下,保护材料(610)从光学装置(10)中取出。

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