公开(公告)号：EP1190609A1

公开(公告)日：2002-03-27

申请号：EP00939975.9

申请日：2000-06-20

Applicant: AlliedSignal Inc.

Inventor： Haas, David R. ,  McAuliffe, Mavyn ,  XU, Chengzeng

IPC: H05K3/46 ,  H05K1/03

CPC classification number: H05K3/4673 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0251 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T442/2008 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2762 ,  Y10T442/2861 ,  Y10T442/2926

Abstract: This invention concerns electronic substrates comprising a non-woven filler material cousisting primarily of micro-fiber glass, and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs (16, 18), metal clad laminates, and printed wiring boards with and without lased via holes (20). The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg (16, 18) and forming at least one via (20) in the prepreg (16, 18).