WIRELESS CHARGING SYSTEMS FOR ELECTRONIC DEVICES

    公开(公告)号:EP3726700A1

    公开(公告)日:2020-10-21

    申请号:EP20160209.1

    申请日:2020-02-28

    Applicant: Apple Inc.

    Abstract: Embodiments describe a portable electronic device that includes a housing having an interface surface and an inductor coil disposed within the housing and comprising a conductive wire wound in a plurality of turns about a center point and in increasing radii such that the inductor coil is substantially planar. The portable electronic device further includes charging circuitry coupled to the inductor coil and configured to operate the inductor coil to wirelessly receive power and wirelessly transmit power, control circuitry coupled to the charging circuitry and configured to instruct the charging circuitry to operate the inductor coil to wirelessly receive power and to wirelessly transmit power, and a device detection coil coupled to the control circuitry and configured to detect the presence of an external device on the charging surface, the device detection coil is configured to operate at a different frequency from the inductor coil.

    INDUCTIVE MODULE
    4.
    发明公开
    INDUCTIVE MODULE 审中-公开

    公开(公告)号:EP3364433A1

    公开(公告)日:2018-08-22

    申请号:EP18150579.3

    申请日:2018-01-08

    Applicant: Apple Inc.

    Abstract: Embodiments describe a wireless power receiving module to receive magnetic flux for wireless power transfer. The wireless power receiving module includes a receiver coil comprising a single length of wire wound into a plurality of turns, an electromagnetic receiver shield coupled to a first side of the receiver coil, a ferrite layer coupled to a second side of the receiver coil opposite of the first side, the ferrite layer positioned to redirect magnetic flux during the charging event to improve charging efficiency, and a thermal mitigation shield comprising a thermally conductive layer adhered to an electrically conductive layer where the electrically conductive layer is coupled to ground, and where the ferrite layer is sandwiched between the thermal mitigation shield and the receiver coil.

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