-
公开(公告)号:EP4465658A3
公开(公告)日:2025-02-26
申请号:EP24205115.9
申请日:2019-04-02
Applicant: Apple Inc.
Inventor: SIAHAAN, Edward , BLOOM, Daniel R , PANECKI, Lee M , QIAN, Phillip , SHAFFER, Benjamin A , STRINGER, Christopher J , WHANG, Eugene A , NARAJOWSKI, David H , OSHITA, Scott Y , DOCHERTY, Sean J , HATFIELD, Dustin A , SEGRAVES, Zachary G
IPC: H04R5/033
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
-
公开(公告)号:EP4465658A2
公开(公告)日:2024-11-20
申请号:EP24205115.9
申请日:2019-04-02
Applicant: Apple Inc.
Inventor: SIAHAAN, Edward , BLOOM, Daniel R , PANECKI, Lee M , QIAN, Phillip , SHAFFER, Benjamin A , STRINGER, Christopher J , WHANG, Eugene A , NARAJOWSKI, David H , OSHITA, Scott Y , DOCHERTY, Sean J , HATFIELD, Dustin A , SEGRAVES, Zachary G
IPC: H04R5/033
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
-