公开(公告)号：EP3629591A1

公开(公告)日：2020-04-01

申请号：EP19200547.8

申请日：2019-09-30

Applicant: Apple Inc.

Inventor： STANLEY, Craig M. ,  MCINTOSH, Sean T. ,  HUWE, Ethan L. ,  TWEHUES, Brian R. ,  GHAHRI SARABI, Mohammad Soroush ,  ANDERSEN, Esge ,  ZHANG, Mei ,  GRINKER, Scott ,  PARKER, Samuel ,  DELLA ROSA, Jason C. ,  SIAHAAN, Edward ,  JUHNKE, Ethan W ,  LEBLANC, Jason J. ,  COUSINS, Benjamin ,  SANG, Haochuan ,  JI, Qigen ,  CHAWAN, Arun D ,  PANECKI, Lee M ,  ZHU, Hao ,  HUA, Thanh P

IPC: H04R1/08 ,  H04R1/10

Abstract: Embodiments describe an attachment mechanism including a wire bent in various directions forming a spring compressible in lateral directions. The wire includes a first wireform feature and a second wireform feature extending from the first wireform feature, where the first wireform feature and the second wireform feature each include: an intermediate segment; a u-shaped segment extending from the intermediate segment; and an end segment extending from the u-shaped segment.

公开(公告)号：EP3629592A1

公开(公告)日：2020-04-01

申请号：EP19200551.0

申请日：2019-09-30

Applicant: Apple Inc.

Inventor： JI, Qigen ,  ZHU, Hao ,  SANG, Haochuan ,  COUSINS, Benjamin A ,  WU, Meiting ,  MCINTOSH, Sean T. ,  DELLA ROSA, Jason C. ,  HUWE, Ethan ,  STANLEY, Craig M. ,  TWEHUES, Brian R. ,  GRINKER, Scott ,  ANDERSEN, Esge ,  PARKER, Samuel ,  SIAHAAN, Edward ,  JUHNKE, Ethan W. ,  ZHANG, Mei ,  HUA, Thanh P ,  CHAWAN, Arun D ,  PANECKI, Lee M ,  LEBLANC, Jason J. ,  GHAHRI SARABI, Mohammad Soroush

IPC: H04R1/08 ,  H04R1/10 ,  A45C13/10 ,  A45C11/00

Abstract: Embodiments describe a magnetic securing component including a set of magnets positioned laterally adjacent to one another and having a curved top surface defined by individual curved top surfaces of each magnet in the set of magnets. The set of magnets includes: first and second magnets positioned laterally adjacent to one another, where the first and second magnets each have a polarity that is oriented parallel to a vertical dimension; and third and fourth magnets laterally positioned from the first and second magnets, where the third magnet is positioned adjacent to the first magnet and the fourth magnet is positioned adjacent to the second magnet, the third and fourth magnets each having a magnetic polarity that is oriented at an angle with respect to the vertical dimension.

公开(公告)号：EP4465658A3

公开(公告)日：2025-02-26

申请号：EP24205115.9

申请日：2019-04-02

Applicant: Apple Inc.

Inventor： SIAHAAN, Edward ,  BLOOM, Daniel R ,  PANECKI, Lee M ,  QIAN, Phillip ,  SHAFFER, Benjamin A ,  STRINGER, Christopher J ,  WHANG, Eugene A ,  NARAJOWSKI, David H ,  OSHITA, Scott Y ,  DOCHERTY, Sean J ,  HATFIELD, Dustin A ,  SEGRAVES, Zachary G

IPC: H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：EP4027652A2

公开(公告)日：2022-07-13

申请号：EP21213102.3

申请日：2021-12-08

Applicant: Apple Inc.

Inventor： PANECKI, Lee M ,  MINERBI, Michael B. ,  MCINTOSH, Sean T.

IPC: H04R1/02 ,  H04R1/10

Abstract: An earphone comprising: a device housing that defines an internal cavity within the device housing; an acoustic port formed through a wall of the device housing and having an opening at an exterior surface of the device housing; an audio driver disposed within the device housing and aligned to emit sound through the acoustic port; and a mesh disposed within the acoustic port and having an outer periphery spaced apart from the device housing wall, wherein the mesh forms a portion of an exterior surface of the earphone that is recessed from the opening at the exterior surface of the device housing.

公开(公告)号：EP4027652A3

公开(公告)日：2022-09-28

申请号：EP21213102.3

申请日：2021-12-08

Applicant: Apple Inc.

Inventor： PANECKI, Lee M ,  MINERBI, Michael B. ,  MCINTOSH, Sean T.

IPC: H04R1/02 ,  H04R1/10

Abstract: An earphone comprising: a device housing that defines an internal cavity within the device housing; an acoustic port formed through a wall of the device housing and having an opening at an exterior surface of the device housing; an audio driver disposed within the device housing and aligned to emit sound through the acoustic port; and a mesh disposed within the acoustic port and having an outer periphery spaced apart from the device housing wall, wherein the mesh forms a portion of an exterior surface of the earphone that is recessed from the opening at the exterior surface of the device housing.

公开(公告)号：EP4465658A2

公开(公告)日：2024-11-20

申请号：EP24205115.9

申请日：2019-04-02

Applicant: Apple Inc.

Inventor： SIAHAAN, Edward ,  BLOOM, Daniel R ,  PANECKI, Lee M ,  QIAN, Phillip ,  SHAFFER, Benjamin A ,  STRINGER, Christopher J ,  WHANG, Eugene A ,  NARAJOWSKI, David H ,  OSHITA, Scott Y ,  DOCHERTY, Sean J ,  HATFIELD, Dustin A ,  SEGRAVES, Zachary G

IPC: H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：EP3629593A1

公开(公告)日：2020-04-01

申请号：EP19200553.6

申请日：2019-09-30

Applicant: Apple Inc.

Inventor： MCINTOSH, Sean T. ,  DELLA ROSA, Jason C. ,  PARKER, Samuel G. ,  COUSINS, Benjamin A. ,  HUWE, Ethan L. ,  GRINKER, Scott ,  ANDERSEN, Esge ,  STANLEY, Craig M. ,  JUHNKE, Ethan W ,  SIAHAAN, Edward ,  ZHANG, Mei ,  TWEHUES, Brian R. ,  HUA, Thanh P ,  SANG, Haochuan ,  CHAWAN, Arun D ,  PANECKI, Lee M ,  LEBLANC, Jason J. ,  JI, Qigen ,  GHAHRI SARABI, Mohammad Soroush ,  HAO, Zhu

IPC: H04R1/08 ,  H04R1/10

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.