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公开(公告)号：US20200296824A1
公开(公告)日：2020-09-17
申请号：US16551334
申请日：2019-08-26
Applicant: Apple Inc.
Inventor： Sunil M. Akre , Kejiu Zhang
Abstract: The disclosed technology relates to a power supply circuit that utilizes an integrated power module that has a first and second power converter disposed on opposite sides of an inductor core. The power supply circuit includes an inductor core comprising a plurality of nano-magnetic layers embedded within a printed circuit board, a first winding disposed on a first outer surface of the inductor core, a second winding disposed on a second outer surface of the inductor core, a first active layer disposed on an outer surface of the first winding, a second active layer disposed on an outer surface of the second winding, a first capacitor tile disposed on an outer surface of the first active layer, and a second capacitor tile disposed on an outer surface of the second active layer.
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公开(公告)号：US10932366B2
公开(公告)日：2021-02-23
申请号：US15942970
申请日：2018-04-02
Applicant: Apple Inc.
Inventor： Sunil M. Akre , Shawn X. Arnold
Abstract: Embedded PCB (printed circuit board) is used for the packaging and assembly of a low profile power conversion system module that can be employed in space constrained environment of small computer/electronic systems. The low profile power conversion system module may include an embedded PCB, a power silicon device embedded within the PCB, a magnetic component which is either embedded within the PCB or disposed on the PCB, or input/output terminals disposed on the side of the embedded PCB. The embedded PCB and the magnetic component may be thin planar shaped to save vertical space. The low profile power conversion system module can be placed inside a cavity formed in the system PCB to save even more vertical space.
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3.发明申请LOW PROFILE PACKAGING AND ASSEMBLY OF A POWER CONVERSION SYSTEM IN MODULAR FORM 有权模块化功率转换系统的低剖面包装和组装公开(公告)号：US20140218155A1
公开(公告)日：2014-08-07
申请号：US14163852
申请日：2014-01-24
Applicant: Apple Inc.
Inventor： Sunil M. Akre , Shawn X. Arnold
CPC classification number: H05K1/141 , H05K1/144 , H05K1/165 , H05K1/185 , H05K2201/086 , Y10T29/4913
Abstract: Embedded PCB (printed circuit board) is used for the packaging and assembly of a low profile power conversion system module that can be employed in space constrained environment of small computer/electronic systems. The low profile power conversion system module includes an embedded PCB, a power silicon device embedded within the PCB, a magnetic component which is either embedded within the PCB or disposed on the PCB, and input/output terminals disposed on the side of the embedded PCB. The embedded PCB and the magnetic component are thin planar shaped to save vertical space. The low profile power conversion system module can be placed inside a cavity formed in the system PCB to save even more vertical space.
Abstract translation: 嵌入式PCB（印刷电路板）用于封装和组装小型电力转换系统模块，可用于小型计算机/电子系统的空间受限的环境中。 低剖面功率转换系统模块包括嵌入式PCB，嵌入PCB内的功率硅器件，嵌入在PCB内或布置在PCB上的磁性部件，以及设置在嵌入式PCB侧面的输入/输出端子 。 嵌入式PCB和磁性元件是薄平面形状，以节省垂直空间。 低功率转换系统模块可以放置在系统PCB中形成的腔内，以节省更多的垂直空间。
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公开(公告)号：US11375607B2
公开(公告)日：2022-06-28
申请号：US16551303
申请日：2019-08-26
Applicant: Apple Inc.
Inventor： Kejiu Zhang , Sunil M. Akre
Abstract: The disclosed technology relates to a power supply circuit that utilizes a double-sided printed circuit board (PCB) that has a first surface and a second surface. The second surface is disposed opposite the first surface. Mounted on the first surface is a first power stage and a first inductor. Mounted on the second surface is a second power stage and a second inductor. The second power stage is disposed opposite the first power stage. The second inductor is disposed opposite the first inductor.
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公开(公告)号：US11357101B2
公开(公告)日：2022-06-07
申请号：US16551334
申请日：2019-08-26
Applicant: Apple Inc.
Inventor： Sunil M. Akre , Kejiu Zhang
Abstract: The disclosed technology relates to a power supply circuit that utilizes an integrated power module that has a first and second power converter disposed on opposite sides of an inductor core. The power supply circuit includes an inductor core comprising a plurality of nano-magnetic layers embedded within a printed circuit board, a first winding disposed on a first outer surface of the inductor core, a second winding disposed on a second outer surface of the inductor core, a first active layer disposed on an outer surface of the first winding, a second active layer disposed on an outer surface of the second winding, a first capacitor tile disposed on an outer surface of the first active layer, and a second capacitor tile disposed on an outer surface of the second active layer.
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Patent Agency Ranking
公开(公告)号：US10063149B2
公开(公告)日：2018-08-28
申请号：US15631811
申请日：2017-06-23
Applicant: Apple Inc.
Inventor： Sunil M. Akre , Suresh B. Kariyadan , Vincent W. Trimeloni
CPC classification number: H02M3/1584 , H02M1/084 , H02M3/00 , H02M2003/1586 , H03K7/08
Abstract: A module stack includes a lower module, a middle module above the lower module, and an upper module above the middle module. The lower module has power stage control circuitry configured to convert a PWM input signal into phase driver control signals, and power stages to be controlled by the phase driver control signals, respectively. The middle module has phase inductors each having a respective winding and a respective magnetic core. The respective winding has one end joined to a respective one of the power stages in the lower module and another end joined to a common node in the middle module. The upper module has a current sense resistor that has one end joined to the common node in the middle module and another end joined to an output node in the upper module. Other embodiments are also described and claimed.
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公开(公告)号：US20170093300A1
公开(公告)日：2017-03-30
申请号：US15069659
申请日：2016-03-14
Applicant: Apple Inc.
Inventor： Sunil M. Akre
CPC classification number: H02M7/003 , G06F1/26 , H05K1/0265 , H05K1/165 , H05K2201/086
Abstract: A power conversion device includes a winding portion and a core portion. The winding portion can be embedded within a plurality of layers of a system printed circuit board. The core portion can be located within one or more elements of the power conversion device that are separate from the system printed circuit board.
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公开(公告)号：US20170090500A1
公开(公告)日：2017-03-30
申请号：US14994843
申请日：2016-01-13
Applicant: Apple Inc.
Inventor： Sunil M. Akre
IPC: G05F3/06
CPC classification number: G05F3/06
Abstract: An electronic device may include electrical components. Each component may be powered at a different respective voltage. Voltage converter circuitry may convert a power supply input voltage into a suitable voltage for powering a corresponding component. The converter may include permanent magnets that include hard ferromagnetic materials. An inductor may be formed adjacent to the permanent magnets and within the magnetic field. The magnetic field may contribute to the inductance of the inductor. The inductor may be coupled between power switching circuitry and an output path. The power switching circuitry may receive the input voltage and may apply a duty cycle to the input voltage to generate an intermediate signal. The inductor may generate an output voltage having a different magnitude than the input voltage based on the intermediate signal. The inductor may provide the output voltage to the electrical component over the output path for powering the electrical component.
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公开(公告)号：US20200315000A1
公开(公告)日：2020-10-01
申请号：US16551303
申请日：2019-08-26
Applicant: Apple Inc.
Inventor： Kejiu Zhang , Sunil M. Akre
Abstract: The disclosed technology relates to a power supply circuit that utilizes a double-sided printed circuit board (PCB) that has a first surface and a second surface. The second surface is disposed opposite the first surface. Mounted on the first surface is a first power stage and a first inductor. Mounted on the second surface is a second power stage and a second inductor. The second power stage is disposed opposite the first power stage. The second inductor is disposed opposite the first inductor.
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公开(公告)号：US20180228026A1
公开(公告)日：2018-08-09
申请号：US15942970
申请日：2018-04-02
Applicant: Apple Inc.
Inventor： Sunil M. Akre , Shawn X. Arnold
CPC classification number: H05K1/141 , H05K1/144 , H05K1/165 , H05K1/185 , H05K2201/086 , Y10T29/4913
Abstract: Embedded PCB (printed circuit board) is used for the packaging and assembly of a low profile power conversion system module that can be employed in space constrained environment of small computer/electronic systems. The low profile power conversion system module may include an embedded PCB, a power silicon device embedded within the PCB, a magnetic component which is either embedded within the PCB or disposed on the PCB, or input/output terminals disposed on the side of the embedded PCB. The embedded PCB and the magnetic component may be thin planar shaped to save vertical space. The low profile power conversion system module can be placed inside a cavity formed in the system PCB to save even more vertical space.
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