公开(公告)号：US20230282454A1

公开(公告)日：2023-09-07

申请号：US17685046

申请日：2022-03-02

Applicant: Applied Materials, Inc.

Inventor： Youngki Chang ,  Muhannad Mustafa ,  Kartik Shah ,  Dhritiman Subha Kashyap ,  Dhivanraj Subramanian

IPC: H01J37/32

CPC classification number: H01J37/32651 ,  H01J37/32715

Abstract: Processing chambers, substrate supports and thermal shields are described. A thermal shield comprises a disc-shaped body having a thickness, an outer diameter with a first edge and a second edge at opposite ends of a diameter of the disc-shaped body, a front surface and a back surface defining the thickness. The front surface has a first longitudinal region comprising the first edge and a second longitudinal region comprising the second edge. Coating one or more of the first longitudinal region or the second longitudinal region with an emissivity material (i.e., emissivity) reduces side to side temperature variation. In some embodiments, processing chambers having the thermal shield described herein consume less power than comparative processing chambers that do not include a thermal shield.