公开(公告)号：US11846011B2

公开(公告)日：2023-12-19

申请号：US17979099

申请日：2022-11-02

Applicant: Applied Materials, Inc.

Inventor： Shuran Sheng ,  Lin Zhang ,  Joseph C. Werner

IPC: C23C16/50 ,  H01J37/32 ,  H01L21/67 ,  C23C16/458 ,  H01L21/02 ,  H01L21/687 ,  H10B41/20 ,  H10B43/20

CPC classification number: C23C16/50 ,  C23C16/4583 ,  H01J37/3244 ,  H01J37/32724 ,  H01J37/32899 ,  H01L21/67017 ,  H01L21/67167 ,  H01J2237/002 ,  H01J2237/3321 ,  H01L21/022 ,  H01L21/0217 ,  H01L21/02164 ,  H01L21/02274 ,  H01L21/68742 ,  H10B41/20 ,  H10B43/20

Abstract: Exemplary semiconductor processing chambers may include a substrate support positioned within a processing region of the semiconductor processing chamber. The chamber may include a lid plate. The chamber may include a gasbox positioned between the lid plate and the substrate support. The gasbox may be characterized by a first surface and a second surface opposite the first surface. The gasbox may define a central aperture. The gasbox may define an annular channel in the first surface of the gasbox extending about the central aperture through the gasbox. The gasbox may include an annular cover extending across the annular channel defined in the first surface of the gasbox. The chamber may include a blocker plate positioned between the gasbox and the substrate support. The chamber may include a ferrite block positioned between the lid plate and the blocker plate.

公开(公告)号：US20230049431A1

公开(公告)日：2023-02-16

申请号：US17979099

申请日：2022-11-02

Applicant: Applied Materials, Inc.

Inventor： Shuran Sheng ,  Lin Zhang ,  Joseph C. Werner

IPC: C23C16/50 ,  H01J37/32 ,  H01L21/67 ,  C23C16/458 ,  H01L21/02 ,  H01L27/11551 ,  H01L21/687 ,  H01L27/11578

Abstract: Exemplary semiconductor processing chambers may include a substrate support positioned within a processing region of the semiconductor processing chamber. The chamber may include a lid plate. The chamber may include a gasbox positioned between the lid plate and the substrate support. The gasbox may be characterized by a first surface and a second surface opposite the first surface. The gasbox may define a central aperture. The gasbox may define an annular channel in the first surface of the gasbox extending about the central aperture through the gasbox. The gasbox may include an annular cover extending across the annular channel defined in the first surface of the gasbox. The chamber may include a blocker plate positioned between the gasbox and the substrate support. The chamber may include a ferrite block positioned between the lid plate and the blocker plate.

公开(公告)号：US11094647B2

公开(公告)日：2021-08-17

申请号：US16533145

申请日：2019-08-06

Applicant: Applied Materials, Inc.

Inventor： Shuran Sheng ,  Lin Zhang ,  Joseph C. Werner

IPC: H01L21/02 ,  H01L23/00 ,  H01L27/11582 ,  C23C16/50 ,  C23C16/26 ,  C23C14/10 ,  C23C14/06 ,  C23C16/40 ,  C23C16/34 ,  C23C14/35

Abstract: A method and apparatus for forming a backside coating on a substrate to counteract stresses from a previously deposited film is disclosed. In one embodiment, a method for flattening a bowed substrate includes providing a substrate having a film stack formed on a first major surface thereof, wherein the substrate comprises a bowed orientation, and forming a coating a second major surface of the substrate, wherein the coating is configured to counter stresses produced by the film stack and flattens the substrate from the bowed orientation.

公开(公告)号：US12068180B2

公开(公告)日：2024-08-20

申请号：US16247026

申请日：2019-01-14

Applicant: Applied Materials, Inc.

Inventor： Xuesong Lu ,  Lin Zhang ,  Joseph C. Werner ,  Jang Seok Oh ,  Balaji Pasupathy ,  Michael W. Johnson

IPC: H01L21/67 ,  C23C16/455 ,  C23C16/50 ,  C23C16/52 ,  G01K3/00 ,  G01K3/04 ,  G01K3/10 ,  G05B11/00 ,  G05B13/02 ,  G05B15/00 ,  G05B15/02 ,  H01J37/32 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67248 ,  C23C16/455 ,  C23C16/45544 ,  C23C16/50 ,  C23C16/52 ,  G01K3/005 ,  G01K3/04 ,  G01K3/10 ,  G05B11/00 ,  G05B13/02 ,  G05B15/00 ,  G05B15/02 ,  H01J37/3244 ,  H01J37/32899 ,  H01L21/02 ,  H01L21/02312 ,  H01L21/67 ,  H01L21/67017 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67167 ,  H01L21/67207 ,  H01L21/67253 ,  H01L21/68742 ,  H01J2237/24585 ,  H01J2237/3321

Abstract: Embodiments herein provide methods of monitoring temperatures of fluid delivery conduits for delivering fluids to, and other components external to, a processing volume of a processing chamber used in electronic device fabrication manufacturing, and monitoring systems related thereto. In one embodiment, a method of monitoring a processing system includes receiving, through a data acquisition device, temperature information from one or more temperature sensors and receiving context information from a system controller coupled to a processing system comprising the processing chamber. Here, the one or more temperature sensors are disposed in one or more locations external to a processing volume of a processing chamber. The context information relates to instructions executed by the system controller to control one or more operations of the processing system.

公开(公告)号：US11866821B2

公开(公告)日：2024-01-09

申请号：US16806656

申请日：2020-03-02

Applicant: Applied Materials, Inc.

Inventor： Shuran Sheng ,  Lin Zhang ,  Jiyong Huang ,  Joseph C. Werner ,  Stanley Wu ,  Mahesh Adinath Kanawade ,  Yikai Chen ,  Yixing Lin ,  Ying Ma

IPC: C23C16/44 ,  C01F17/265 ,  C23C16/458 ,  C01F17/229 ,  C01F17/218

CPC classification number: C23C16/4404 ,  C01F17/265 ,  C23C16/4405 ,  C23C16/4581 ,  C23C16/4585 ,  C01F17/218 ,  C01F17/229

Abstract: Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber. In one embodiment, a substrate support cover includes a bulk member coated with a fluoride coating. The substrate support cover is placed on a substrate support disposed in the processing chamber during a cleaning process. The fluoride coating does not react with the cleaning species. The substrate support cover protects the substrate support from reacting with the cleaning species, leading to reduced condensation formed on chamber components, which in turn leads to reduced contamination of the substrate in subsequent processes.

公开(公告)号：US11499231B2

公开(公告)日：2022-11-15

申请号：US16844089

申请日：2020-04-09

Applicant: Applied Materials, Inc.

Inventor： Shuran Sheng ,  Lin Zhang ,  Joseph C. Werner

IPC: C23C16/50 ,  H01J37/32 ,  H01L21/67 ,  C23C16/458 ,  H01L21/02 ,  H01L27/11551 ,  H01L27/11578 ,  H01L21/687

Abstract: Exemplary semiconductor processing chambers may include a substrate support positioned within a processing region of the semiconductor processing chamber. The chamber may include a lid plate. The chamber may include a gasbox positioned between the lid plate and the substrate support. The gasbox may be characterized by a first surface and a second surface opposite the first surface. The gasbox may define a central aperture. The gasbox may define an annular channel in the first surface of the gasbox extending about the central aperture through the gasbox. The gasbox may include an annular cover extending across the annular channel defined in the first surface of the gasbox. The chamber may include a blocker plate positioned between the gasbox and the substrate support. The chamber may include a ferrite block positioned between the lid plate and the blocker plate.

公开(公告)号：US12013291B2

公开(公告)日：2024-06-18

申请号：US17070803

申请日：2020-10-14

Applicant: Applied Materials, Inc.

Inventor： Shuran Sheng ,  Lin Zhang ,  Joseph C. Werner

IPC: G01K3/00 ,  G01K3/10 ,  G03F7/42 ,  G06F119/08

CPC classification number: G01K3/005 ,  G01K3/10 ,  G03F7/427 ,  G06F2119/08

Abstract: Embodiments herein provide methods of monitoring temperatures of fluid delivery conduits for delivering fluids to, and other components external to, a processing volume of a processing chamber used in electronic device fabrication manufacturing, and monitoring systems related thereto. In one embodiment, a method includes receiving, at the temperature monitoring system (TMS) controller, information from a first plurality of temperature sensors and a second plurality of temperature sensors, comparing, using the TMS controller, the temperature information to one or more pre-determined control limits, and communicating, using the TMS controller, an out-of-control event to a user. Generally, the temperature monitoring system features the first and second pluralities of temperature sensors, the TMS controller, a first connection module, and a second connection module.

公开(公告)号：US11837448B2

公开(公告)日：2023-12-05

申请号：US17242059

申请日：2021-04-27

Applicant: Applied Materials, Inc.

Inventor： Shuran Sheng ,  Lin Zhang ,  Jiyong Huang ,  Jang Seok Oh ,  Joseph C. Werner ,  Nitin Khurana ,  Ganesh Balasubramanian ,  Jennifer Y. Sun ,  Xinhai Han ,  Zhijun Jiang

IPC: H01J37/32 ,  C23C16/44 ,  B08B7/00

CPC classification number: H01J37/32862 ,  B08B7/0035 ,  C23C16/4405 ,  H01J37/32449 ,  H01J37/32724 ,  H01J2237/335 ,  H01J2237/3321

Abstract: Examples disclosed herein relate to a method and apparatus for cleaning and repairing a substrate support having a heater disposed therein. A method includes (a) cleaning a surface of a substrate support having a bulk layer, the substrate support is disposed in a processing environment configured to process substrates. The cleaning process includes forming a plasma at a high temperature from a cleaning gas mixture having a fluorine containing gas and oxygen. The method includes (b) removing oxygen radicals from the processing environment with a treatment plasma formed from a treatment gas mixture. The treatment gas mixture includes the fluorine containing gas. The method further includes (c) repairing an interface of the substrate support and the bulk layer with a post-treatment plasma. The post-treatment plasma is formed from a post-treatment gas mixture including a nitrogen containing gas. The high temperature is greater than or equal to about 500 degrees Celsius.

公开(公告)号：US11215934B2

公开(公告)日：2022-01-04

申请号：US16934597

申请日：2020-07-21

Applicant: APPLIED MATERIALS, INC.

Inventor： Ralph Peter Antonio ,  Shuran Sheng ,  Lin Zhang ,  Joseph C. Werner

IPC: G03F7/00 ,  H01L21/67 ,  G03F7/20

Abstract: Methods and apparatus for detecting ultraviolet light are provided herein. For example, an ultraviolet (UV) process chamber includes a vacuum window or a transparent showerhead; a UV light source disposed above one of the vacuum window or the transparent showerhead and configured to generate and transmit UV light into a process volume of the UV process chamber; and a first UV sensor configured to measure at least one of emissivity from the UV light source or irradiance of the UV light transmitted into the process volume and to transmit a signal corresponding to a measured at least one of emissivity from the UV light source or irradiance of the UV light to a controller coupled to the UV process chamber during operation.

公开(公告)号：US20210317578A1

公开(公告)日：2021-10-14

申请号：US16844089

申请日：2020-04-09

Applicant: Applied Materials, Inc.

Inventor： Shuran Sheng ,  Lin Zhang ,  Joseph C. Werner

IPC: C23C16/50 ,  H01J37/32 ,  H01L21/67 ,  C23C16/458

Abstract: Exemplary semiconductor processing chambers may include a substrate support positioned within a processing region of the semiconductor processing chamber. The chamber may include a lid plate. The chamber may include a gasbox positioned between the lid plate and the substrate support. The gasbox may be characterized by a first surface and a second surface opposite the first surface. The gasbox may define a central aperture. The gasbox may define an annular channel in the first surface of the gasbox extending about the central aperture through the gasbox. The gasbox may include an annular cover extending across the annular channel defined in the first surface of the gasbox. The chamber may include a blocker plate positioned between the gasbox and the substrate support. The chamber may include a ferrite block positioned between the lid plate and the blocker plate.