公开(公告)号：US20200373134A1

公开(公告)日：2020-11-26

申请号：US16848614

申请日：2020-04-14

Applicant: Applied Materials, Inc.

Inventor： Alexander N. LERNER ,  Michael P. KARAZIM ,  Andrew J. CONSTANT ,  Jeffrey A. BRODINE ,  Kim Ramkumar VELLORE ,  Kevin MORAES ,  Roey SHAVIV

IPC: H01J37/32 ,  C23C16/04 ,  H01L21/68 ,  H01L21/677 ,  H01L21/673

Abstract: An alignment module for housing and cleaning masks. The alignment module comprises a mask stocker, a cleaning chamber, an alignment chamber, an alignment stage a transfer robot. The mask stocker is configured to house a mask cassette configured to store a plurality of masks. The cleaning chamber is configured to clean the plurality of masks by providing one or more cleaning gases into a chamber after a mask is inserted into the cleaning chamber. The alignment stage is configured to support a carrier and a substrate. The transfer robot is configured to transfer a mask from one or more of the alignment stage and the mask stocker to the cleaning chamber.

公开(公告)号：US20210025048A1

公开(公告)日：2021-01-28

申请号：US16923600

申请日：2020-07-08

Applicant: Applied Materials, Inc.

Inventor： Alexander N. LERNER ,  Roey SHAVIV ,  Satish RADHAKRISHNAN

IPC: C23C14/24 ,  C23C14/50 ,  C23C14/04

Abstract: One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, process chamber is provided that includes a lid plate having a plurality of cooling channels formed therein, a pedestal, the pedestal having a plurality of cooling channels formed therein, and a showerhead, wherein the showerhead comprises a plurality of segments and each segment is at least partially surrounded by a shield.

公开(公告)号：US20230042777A1

公开(公告)日：2023-02-09

申请号：US17971692

申请日：2022-10-24

Applicant: Applied Materials, Inc.

Inventor： Alexander N. LERNER ,  Roey SHAVIV ,  Prashanth KOTHNUR ,  Satish RADHAKRISHNAN ,  Xiaozhou CHE

IPC: C23C16/448 ,  C23C16/458 ,  C23C16/455 ,  C23C16/52 ,  C23C14/00 ,  C23C16/00

Abstract: One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, a process system includes different materials each contained in separate ampoules. Each material is flowed into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.

公开(公告)号：US20200048784A1

公开(公告)日：2020-02-13

申请号：US16656026

申请日：2019-10-17

Applicant: Applied Materials, Inc.

Inventor： Ismail EMESH ,  Roey SHAVIV ,  Chris PABELICO

IPC: C25D3/18 ,  C25D7/12

Abstract: Implementations of the disclosure may include methods of electroplating features formed on a semiconductor device, such as the trenches and vias formed by single or dual Damascene processes using a cobalt plating bath. The cobalt electroplating bath may contain “additive packages” or “additive systems” that include a combination of additives in certain ratios that facilitate the metal filling of high aspect ratio sub-micrometer features. Implementations of the disclosure provide new cobalt plating bath methods and chemistries and that include alkyl modified imidazoles, imidazolines, and imidazolidines suppressor compounds.

公开(公告)号：US20210069745A1

公开(公告)日：2021-03-11

申请号：US17013462

申请日：2020-09-04

Applicant: Applied Materials, Inc.

Inventor： Alexander N. LERNER ,  Roey SHAVIV ,  Phillip STOUT ,  Prashanth KOTHNUR ,  Joseph M. RANISH

IPC: B05D1/00 ,  B05B1/00 ,  B05B15/60 ,  B05B1/18 ,  B05B11/00 ,  B05B12/14 ,  B05B1/16

Abstract: Embodiments of the present disclosure generally relate to organic vapor deposition systems and substrate processing methods related thereto. In one embodiment, a processing system comprises a lid assembly and a plurality of material delivery systems. The lid assembly includes lid plate having a first surface and a second surface disposed opposite of the first surface and a showerhead assembly coupled to the first surface. The showerhead assembly comprises a plurality of showerheads. Individual ones of the plurality of material delivery systems are fluidly coupled to one or more of the plurality of showerheads and are disposed on the second surface of the lid plate. Each of the material delivery systems comprise a delivery line, a delivery line valve disposed on the delivery line, a bypass line fluidly coupled to the delivery line at a point disposed between the delivery line valve and the showerhead, and a bypass valve disposed on the bypass line.

公开(公告)号：US20200373183A1

公开(公告)日：2020-11-26

申请号：US16848645

申请日：2020-04-14

Applicant: Applied Materials, Inc.

Inventor： Alexander N. LERNER ,  Michael P. KARAZIM ,  Andrew J. CONSTANT ,  Jeffrey A. BRODINE ,  Kim Ramkumar VELLORE ,  Kevin MORAES ,  Roey SHAVIV

IPC: H01L21/68 ,  H01J37/32 ,  C23C16/04 ,  H01L21/677 ,  H01L21/673

Abstract: An alignment module for positioning a mask on a substrate comprises a mask stocker, an alignment stage, and a transfer robot. The mask stocker houses a mask cassette that stores a plurality of masks. The alignment stage is configured to support a carrier and a substrate. The transfer robot is configured to transfer one of the one or more masks from the mask stocker to the alignment stage and position the mask over the substrate. The alignment module may be part of an integrated platform having one or more transfer chambers, a factory interface having a substrate carrier chamber and one or more processing chambers. A carrier may be coupled to a substrate within the substrate carrier chamber and moved between the processing chambers to generate a semiconductor device.

公开(公告)号：US20170247806A1

公开(公告)日：2017-08-31

申请号：US15419430

申请日：2017-01-30

Applicant: Applied Materials, Inc.

Inventor： Ismail EMESH ,  Roey SHAVIV ,  Chris PABELICO

IPC: C25D3/18 ,  C25D7/12

CPC classification number: C25D3/18 ,  C25D7/123

Abstract: Implementations of the disclosure may include methods of electroplating features formed on a semiconductor device, such as the trenches and vias formed by single or dual Damascene processes using a cobalt plating bath. The cobalt electroplating bath may contain “additive packages” or “additive systems” that include a combination of additives in certain ratios that facilitate the metal filling of high aspect ratio sub-micrometer features. Implementations of the disclosure provide new cobalt plating bath methods and chemistries and that include alkyl modified imidazoles, imidazolines, and imidazolidines suppressor compounds.