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    MAGNETRON HAVING ENHANCED COOLING CHARACTERISTICS
    1.
    发明申请
    MAGNETRON HAVING ENHANCED COOLING CHARACTERISTICS 审中-公开

    公开(公告)号：US20190051485A1

    公开(公告)日：2019-02-14

    申请号：US16163226

    申请日：2018-10-17

    Applicant: Applied Materials, Inc.

    Inventor： Govinda RAJ ,  Simon YAVELBERG ,  Ramprakash SANKARAKRISHNAN

    IPC: H01J23/00 ,  B22F5/10 ,  B22F3/105 ,  H01J25/50 ,  B33Y80/00

    Abstract: Magnetron configurations that provide more efficient and/or more uniform cooling characteristics and methods for forming the magnetrons are provided. The magnetron includes one or more flow directing structures disposed between parallel cooling fins. The flow directing structures direct air flow across various surfaces of the cooling fins that otherwise would be obstructed by magnetron components, reducing the incidence and/or magnitude of hot spots on the cooling fins and/or on other magnetron components. The flow directing structures also adjust flow rates to improve cooling efficiency.

    SURFACE ACOUSTIC WAVE SENSORS IN SEMICONDUCTOR PROCESSING EQUIPMENT
    2.
    发明申请
    SURFACE ACOUSTIC WAVE SENSORS IN SEMICONDUCTOR PROCESSING EQUIPMENT 审中-公开

    公开(公告)号：US20170176349A1

    公开(公告)日：2017-06-22

    申请号：US15000092

    申请日：2016-01-19

    Applicant: Applied Materials, Inc.

    Inventor： Ramesh GOPALAN ,  Simon YAVELBERG ,  Zubin HUANG

    IPC: G01N22/00 ,  H01L21/67

    CPC classification number: G01N22/00 ,  H01J37/32935 ,  H01L21/67253

    Abstract: The implementations described herein generally relate to a sensing device for use in the semiconducting industry which sense process parameters to control semiconductor processes. More specifically, the implementations relate to packaging for a surface acoustic wave (SAW) based devices or wireless or RF-responsive sensors for use in the harsh processing environments of a semiconductor processing chamber such that the neither the sensor and its components nor the chamber components interfere with or contaminate one another. The sensor packaging may include various packaging layers with or without protective coatings and a waveguide. The packaging may have a thickness chosen such that the thickness is less than the electromagnetic wavelength of a SAW sensor radio wave. The sensing devices may be disposed in cavities of the chamber, the processing volume, on chamber components, and/or on the substrate.

    RETAINING RING FOR LOWER WAFER DEFECTS
    5.
    发明申请
    RETAINING RING FOR LOWER WAFER DEFECTS 审中-公开
    用于较低波形缺陷的保持环

    公开(公告)号：US20160271750A1

    公开(公告)日：2016-09-22

    申请号：US15074089

    申请日：2016-03-18

    Applicant: Applied Materials, Inc.

    Inventor： Yongqi HU ,  Simon YAVELBERG ,  Gangadhar SHEELAVANT ,  Kadthala R. NARENDRNATH

    IPC: B24B37/32

    CPC classification number: B24B37/32

    Abstract: A retaining ring and a chemical mechanical planarization system (CMP) are disclosed. In one embodiment, a retaining ring for a polishing system includes a ring-shaped body having a polished inner diameter. The body has a bottom surface having grooves formed therein, an outer diameter wall, and an inner diameter wall, wherein the inner diameter wall is polished to a roughness average (Ra) of less than about 30 microinches (μin).

    Abstract translation: 公开了一种保持环和化学机械平面化系统（CMP）。 在一个实施例中，用于抛光系统的保持环包括具有抛光内径的环形主体。 主体具有形成在其中的槽的底面，外径壁和内径壁，其中内径壁被抛光至小于约30微英寸（μin）的粗糙度平均（Ra）。

    SUBSTRATE POLISHING AND FLUID RECYCLING SYSTEM
    6.
    发明申请
    SUBSTRATE POLISHING AND FLUID RECYCLING SYSTEM 有权
    基板抛光和流体循环系统

    公开(公告)号：US20140069890A1

    公开(公告)日：2014-03-13

    申请号：US14021942

    申请日：2013-09-09

    Applicant: Applied Materials, Inc.

    Inventor： Simon YAVELBERG

    IPC: B24B37/34

    CPC classification number: B24B37/34 ,  B24B57/02 ,  H01L21/67242

    Abstract: Embodiments of the present invention are generally directed to a substrate polishing and slurry recycling system. The system includes an extendable gutter that may be positioned to collect processing slurry from the polishing pad during processing and deliver the consumed slurry to a reclamation tank. The reclaimed slurry may be treated and mixed with fresh slurry for delivery to the polishing pad during subsequent substrate polishing. The extendable gutter may be positioned in a second position during rinsing of the polishing pad so that rinsing fluid passes underneath the gutter and is removed from the system without mixing with the reclaimed slurry.

    Abstract translation: 本发明的实施方案通常涉及基材研磨和浆料再循环系统。 该系统包括可延伸沟槽，其可定位成在处理期间从抛光垫收集处理浆料并将消耗的浆料输送到回收罐。 回收的浆料可以用新鲜的浆料处理和混合，以在随后的基材抛光期间输送到抛光垫。 在漂洗抛光垫期间，可延伸沟槽可以定位在第二位置，使得冲洗流体通过沟槽下方并且在不与再生浆料混合的情况下从系统中移除。

    CHEMICAL MECHANICAL POLISHING SMART RING
    7.
    发明申请
    CHEMICAL MECHANICAL POLISHING SMART RING 审中-公开

    公开(公告)号：US20180071889A1

    公开(公告)日：2018-03-15

    申请号：US15699645

    申请日：2017-09-08

    Applicant: Applied Materials, Inc.

    Inventor： Zubin HUANG ,  Stephen A. WELLS ,  Ramesh GOPALAN ,  Gangadhar SHEELAVANT ,  Simon YAVELBERG

    IPC: B24B37/32 ,  B24B37/04 ,  B24B37/34 ,  G01H11/06 ,  G08C17/02

    Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, and a sensor assembly. The retaining ring is coupled to the body. The sensor assembly is positioned at least partially in the body. The sensor assembly includes a transmitter, an antenna, and a vibrational sensor. The transmitter has a first end and a second end. The antenna is coupled to the first end of the transmitter. The vibrational sensor is coupled to the second end. The vibrational sensor is configured to detect vibration during chemical mechanical processes with respect to radial, azimuthal, and angular axes of the carrier head.

    CORROSION RESISTANT RETAINING RINGS
    9.
    发明申请
    CORROSION RESISTANT RETAINING RINGS 有权

    公开(公告)号：US20170106495A1

    公开(公告)日：2017-04-20

    申请号：US14885944

    申请日：2015-10-16

    Applicant: Applied Materials, Inc.

    Inventor： Gangadhar SHEELAVANT ,  Simon YAVELBERG ,  Yongqi HU

    IPC: B24B37/32

    CPC classification number: B24B37/32

    Abstract: Implementations described herein protect a retaining ring for a polishing system from corrosive polishing chemistries. In one embodiment, a retaining ring has a ring-shaped body having a top surface, an inside diameter sidewall, an outer diameter sidewall and a bottom surface. The inside diameter side wall is configured to circumscribe a substrate. The ring shaped body has a rigid ring-shaped portion, a polymeric ring-shaped portion stacked on the rigid ring-shaped portion and covering at least three sides of the rigid ring-shaped portion, a plurality of grooves formed in the bottom surface, and a plurality of wash ports formed through the polymeric ring-shaped portion, wherein the wash ports are isolated from the rigid ring-shaped portion.

    COATED RETAINING RING
    10.
    发明申请
    COATED RETAINING RING 有权
    涂层保持环

    公开(公告)号：US20150099437A1

    公开(公告)日：2015-04-09

    申请号：US14505231

    申请日：2014-10-02

    Applicant: Applied Materials, Inc.

    Inventor： Daniel L. MARTIN ,  Jeonghoon OH ,  Simon YAVELBERG

    IPC: B24B37/32 ,  C23C16/02 ,  C23C16/455

    CPC classification number: B24B37/32 ,  B05D1/08 ,  B05D1/60 ,  B05D7/52 ,  C09D127/18 ,  C09D165/04

    Abstract: A retaining ring for a polishing system is disclosed. The retaining ring has a process-resistant coating over a portion thereof. The process-resistant coating is a thin, smooth, conformal layer that is resistant to wear and chemical attack. The process-resistant coating is formed by a method that includes vapor deposition from a precursor gas mixture, which may deposit polyparaxyxylene from a gas mixture comprising paracyclophane. Adhesion of the process-resistant coating to the retaining ring may be enhanced by treating the surface of the ring prior to forming the coating. Resistance of the coating to the process may be further enhanced by treating the surface of the coating with an etching or deposition gas to impart texture.

    Abstract translation: 公开了一种用于抛光系统的保持环。 保持环在其一部分上具有耐加工涂层。 耐加工涂层是一种薄而光滑的共形层，耐磨损和化学侵蚀。 耐加工涂层通过包括从前体气体混合物的气相沉积的方法形成，前体气体混合物可以从包含对环磷烷的气体混合物中沉积聚对二甲苯。 可以通过在形成涂层之前处理环的表面来增强耐保护涂层对保持环的粘合性。 通过用蚀刻或沉积气体处理涂层的表面以赋予纹理，可以进一步提高涂层对该方法的耐受性。

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