Abstract:
Methods and apparatus are provided for TMOS devices (40), comprising multiple N-type source regions (50), electrically in parallel, located in multiple P-body regions (46) separated by N-type JFET regions (56) at a first surface. The gate (53) overlies the body channel regions (46) and the JFET region (56) lying between the body regions. The JFET region (56) communicates with an underlying drain region (42) via an N-epi region (44). Ion implantation and heat treatment are used to tailor the net active doping concentration N d in the JFET region (56) of length L acc and net active doping concentration N a in the P-body regions (46) of length L body so that a charge balance relationship (L body * N a ) = k 1 *(L acc * N d ) between P-body and JFET regions is satisfied, where k 1 is about 0.6 = k 1 = 1.4. The entire device (40) can be fabricated using planar technology and the charge balanced regions need not extend through the underlying N-epi region (44) to the drain (42).
Abstract translation:提供了用于TMOS器件(40)的方法和装置,其包括多个并联的N型源极区(50),位于由N型JFET区域(56)分开的多个P体区域(46)中,第一 表面。 栅极(53)覆盖在身体区域(46)和位于身体区域之间的JFET区域(56)之间。 JFET区域(56)经由N-epi区域(44)与下面的漏极区域(42)连通。 离子注入和热处理用于定制长度为L的JFET区域(56)中的净有源掺杂浓度N sub和净活性掺杂浓度N SUB 在长度为L本体的P体区域(46)中的一个 SUB>,使得电荷平衡关系(L SUB> * N SUB> ]]>其中k≠1时,满足P体和JFET区域之间的距离(k)= k 1(N) SUB>约为0.6 = k 1 = 1.4。 整个器件(40)可以使用平面技术制造,并且电荷平衡区域不需要延伸穿过下面的N外延区域(44)到漏极(42)。
Abstract:
An integrated circuit device (800) is provided which comprises a substrate (801), a conductive line (807) configured to experience a pressure, and a magnetic tunnel junction ("MTJ") core (802) formed between the substrate and the current line. The conductive line (807) is configured to move in response to the pressure, and carries a current which generates a magnetic field. The MTJ core (802) has a resistance value which varies based on the magnetic field. The resistance of the MTJ core (802) therefore varies with respect to changes in the pressure. The MTJ core (802) is configured to produce an electrical output signal which varies as a function of the pressure.
Abstract:
Methods and apparatus are provided for sensing physical parameters. The apparatus (30) comprises a magnetic tunnel junction (MTJ) [32] and a magnetic field source (34) whose magnetic field (35) overlaps the MTJ and whose proximity to the MTJ varies in response to an input to the sensor. A magnetic shield (33) is provided at least on a face of the MFS away from the MTJ. The MTJ comprises first and second magnetic electrodes (36, 38) separated by a dielectric (37) configured to permit significant tunneling conduction therebetween. The first magnetic region has its spin axis pinned and the second magnetic electrode has its spin axis free. The magnetic field source is oriented closer to the second magnetic electrode than the first magnetic electrode. The overall sensor dynamic range is extended by providing multiple electrically coupled sensors receiving the same input but with different individual response curves and desirably but not essentially formed on the same substrate.
Abstract:
An integrated circuit device (600) is provided which includes an active circuit component (604, 804) and a current sensor (602, 802). The active circuit component (604, 804) may be coupled between a first conductive layer (206) and a second conductive layer (210), and is configured to produce a first current. The current sensor (602, 802) is disposed over the active circuit component. The current sensor (602, 802) may comprise a Magnetic Tunnel Junction ("MTJ") core disposed between the first conductive layer (206) and the second conductive layer (210). The MTJ core is configured to sense the first current and produce a second current based on the first current sensed at the MTJ core.
Abstract:
Methods and apparatus are provided for sensing physical parameters. The apparatus (30) comprises a magnetic tunnel junction (MTJ) [32] and a magnetic field source (34) whose magnetic field (35) overlaps the MTJ and whose proximity to the MTJ varies in response to an input to the sensor. A magnetic shield (33) is provided at least on a face of the MFS away from the MTJ. The MTJ comprises first and second magnetic electrodes (36, 38) separated by a dielectric (37) configured to permit significant tunneling conduction therebetween. The first magnetic region has its spin axis pinned and the second magnetic electrode has its spin axis free. The magnetic field source is oriented closer to the second magnetic electrode than the first magnetic electrode. The overall sensor dynamic range is extended by providing multiple electrically coupled sensors receiving the same input but with different individual response curves and desirably but not essentially formed on the same substrate.
Abstract:
Methods and apparatus are provided for sensing physical parameters. The apparatus (130) comprises a magnetic tunnel junction (MTJ) (32) and a magnetic field source (34) whose magnetic field (35) overlaps the MTJ and whose proximity to the MTJ varies in response to an input to the sensor. The MTJ comprises first and second magnetic electrodes (36, 38) separated by a dielectric (37) configured to permit significant tunneling conduction therebetween. The first magnetic electrode has its spin axis pinned and the second magnetic electrode has its spin axis free. The magnetic field source is oriented closer to the second magnetic electrode than the first magnetic electrode. The overall sensor dynamic range is extended by providing multiple electrically coupled sensors receiving the same input but with different individual response curves and desirably but not essentially formed on the same substrate (72).
Abstract:
An integrated circuit device (600) is provided which includes a heat source (604) disposed in a substrate (602), and a Magnetic Tunnel Junction ("MTJ") temperature sensor (608) disposed over the heat source.
Abstract:
Techniques of sensing a temperature of a heat source disposed in a substrate of an integrated circuit (600) are provided. According to one exemplary method, a Magnetic Tunnel Junction ("MTJ") temperature sensor (608) is provided over the heat source (604). The MTJ temperature sensor comprises an MTJ core configured to output a current during operation thereof. The value of the current varies based on a resistance value of the particular MTJ core. The resistance value of the MTJ core varies as a function of the temperature of the heat source. A value of the current of the MTJ core can then be associated with a corresponding temperature of the heat source.
Abstract:
An integrated circuit device (300) includes a magnetic random access memory ("MRAM") architecture and a smart power integrated circuit architecture formed on the same substrate (302) using the same fabrication process technology. The fabrication process technology is a modular process having a front end process and a back end process. In the example embodiment, the smart power architecture includes a power circuit component (304), a digital logic component (306), and an analog control component (312) formed by the front end process, and a sensor architecture (308) formed by the back end process. The MRAM architecture (310) includes an MRAM circuit component (314) formed by the front end process and an MRAM cell array (310) formed by the back end process. In one practical embodiment, the sensor architecture (308) includes a sensor component that is formed from the same magnetic tunnel junction core material utilized by the MRAM cell array (316). The concurrent fabrication of the MRAM architecture (310) and the smart power architecture facilitates an efficient and cost effective use of the physical space available over active circuit blocks of the substrate, resulting in three-dimensional integration.
Abstract:
In accordance with a specific embodiment, a method of processing a semiconductor substrate is disclosed whereby the substrate is thinned, and the dice formed on the substrate are singulated by a common process. Trench regions (42, 43) are formed on a backside of the substrate. An isotropic etch of the backside results in a thinning of the substrate while maintaining the depth of the trenches, thereby facilitating singulation of the die.