2.
    发明专利
    未知

    公开(公告)号:DE59609567D1

    公开(公告)日:2002-09-26

    申请号:DE59609567

    申请日:1996-04-03

    Applicant: BASF AG

    Abstract: Thermoplastic moulding materials (I) contg. (A) 1-99 wt% partly aromatic copolyamide contg. (a1) 30-44 mole% terephthalic acid (TPA) units, (a2) 6-25 mole% isophthalic acid (IPA) units, (a3) 43-49.5 mole% hexamethylenediamine (HMDA) units and (a4) 0.5-7 mole% units derived from 6-30C cyclic aliphatic diamines; (B) 1-99 wt% polyether-imide; (C) 0-30 wt% polymeric component with OH gps.; (D) 0-60 wt% fibrous and/or particulate fillers; (E) 0-40 wt% impact modifying rubber; and (F) 0-40 wt% conventional additives, etc.. Also claimed are fibres, films and moulded prods. obtd. from (I).

    3.
    发明专利
    未知

    公开(公告)号:DE59604976D1

    公开(公告)日:2000-05-25

    申请号:DE59604976

    申请日:1996-01-16

    Applicant: BASF AG

    Abstract: A thermoplastic moulding material (I) contains: (A) 5-94 wt.% of a partly aromatic, partly crystalline copolyamide derived from: (a1) 30-44 mole% terephthalic acid (TPA) units; (a2) 6-20 mole% isophthalic acid (IPA) units; (a3) 43-49.5 mole% hexamethylenediamine (HMDA) units; and (a4) 0.5-7 mole% units derived from 6-30C cyclic aliphatic diamines; (B) 5-94 wt.% ABS, ASA or SAN polymer and/or a polymer of (1-18C alkyl) (meth)acrylate; (C) 1-30 wt.% of a coupling agent contg. 0.1-10 wt.% functional monomers (w.r.t. 100 wt.% C.); (D) 0-30 wt.% of a rubber-elastic polymer; (E) 0-45 wt.% of a fibrous and/or particulate filler; and (F) 0-30 wt.% of conventional additives and processing aids. Also claimed are moulded prods. obtd. from (I).

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