2.
    发明专利
    未知

    公开(公告)号:DE1769528A1

    公开(公告)日:1972-01-13

    申请号:DE1769528

    申请日:1968-06-06

    Applicant: BASF AG

    Abstract: 1,264,524. Pressure sensitive adhesive coating. BADISCHE ANILIN-& SODA-FABRIK A.G. 5 June, 1969 [6 June, 1968], No. 28522/ 69. Heading B2E. [Also in Division C3] Articles such as adhesive tapes, adhesive sheeting and film, decorative sheeting, insulating tapes and textile floor coverings are provided with a pressure-sensitive adhesive layer of a copolymer comprising (a) 60-99.85% (by weight) of units of at least one ester of acrylic or methacrylic acid and a C 4 -C 10 alkanol; (b) 0.15-3% of a combination of (i) units of at least one monoester of an α, #- olefinically unsaturated monocarboxylic acid and a glycol and (ii) units of at least one N- alkoxymethylamide of an α, #-olefinically unsaturated carboxylic acid; and (c) 0-39% of units of at least one other mono olefinically unsaturated monomer; the glass temperature of the copolymer being from -60‹C to 0‹C. The glycol monoester monomers b (i) are suitably acrylate or methacrylate esters of alkane diols, cycloalkane diols or haloderivatives of such diols. Suitable as amide monomers b (ii) are those derived, for example, from acrylic, methacrylic, crotonic, maleic, fumaric or itaconic acid. Optional monomers (c) include (meth) acrylate esters other than those used as monomer (a) above, vinyl esters of saturated monocarboxylic acids, vinyl aromatic compounds such as styrene, monovinyl heterocyclic compounds such as vinyl pyridines, vinyl imidazole, vinyl caprolactam and vinyl pyrrolidone, unsaturated carboxylic acids and amides and nitriles thereof, vinyl ethers, vinyl ketones and vinyl or vinylidene halides. The pressure-sensitive adhesive layers are applied to an appropriate substrate material using a solution of the copolymer by conventional. methods, e.g. by pouring or using rollers or coating knives. The solvent component of the copolymer solutions may be selected from alkyl acetates, liquid aromatic hydrocarbons, liquid (cyclo) aliphatic ketones, liquid aliphatic chlorohydrocarbons, dimethylformamide, and aliphatic or heterocyclic ethers. The adhesive solutions may also contain other polymer components, e.g. polyisobutylenes, modified colophony resins and polycondensates of cyclohexanone or methylcyclohexanones, and dihydro abietyl phthalate. Substrate materials to which the adhesive layer can be applied include paper, aluminium foil, sheeting and film of polyethylene, polypropylene, polyvinyl chloride, polystyrene and polyethylene glycol terephthalate, wood veneers, bitumenised board, textile floor coverings and nonwovens, expanded plastics materials of polyurethane, polyether, polyethylene, polyvinyl chloride, natural rubber and synthetic rubber foams in sheet form.

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