1.
    发明专利
    未知

    公开(公告)号:DE59910658D1

    公开(公告)日:2004-11-04

    申请号:DE59910658

    申请日:1999-02-27

    Applicant: BASF AG

    Abstract: The invention relates to thermoplastic molding materials containing A) 20 to 99.9 wt.% of a polyoxymethylene homopolymerizate or copolmerizate; B) 0.0001 to 1.0 wt.% of a nucleating agent which is different from C); C) 0.001 to 5 wt.% of a melamine formaldehyde condensate; D) 0 to 70 wt.% of additional additives, whereby the sums of the weight percentages of the components A) to D) always total 100 %.

    4.
    发明专利
    未知

    公开(公告)号:DE19912600A1

    公开(公告)日:2000-09-21

    申请号:DE19912600

    申请日:1999-03-15

    Applicant: BASF AG

    Abstract: The invention relates to the use of thermoplastic molding material consisting of A) 10 to 99 wt.- % of a polyoxymethylene homo- or copolymer, B) 0.1 to 2 wt.- % of at least one sterically hindered amine compound, C) 0 to 2 wt.- % of at least one stabilizer from the group of the benzotriazole derivatives or benzoate derivatives or benzophenone derivatives, D) 0 to 80 wt.- % of other additives and auxiliary processing agents, the sum of the weight percentages of components A) to D) being in any case 100 %, for producing stable molded parts in acidic and/or oxidative media.

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