1.
    发明专利
    未知

    公开(公告)号:DE10030632A1

    公开(公告)日:2002-01-10

    申请号:DE10030632

    申请日:2000-06-29

    Applicant: BASF AG

    Abstract: The invention relates to thermoplastic molding compounds, comprising at least (A) 10 to 99.99 wt.- % of a polyoxymethylene homopolymer or copolymer, at least (B) 0.01 to 5 wt.- % of a polyethylenimine homopolymer or copolymer, at least (C) 0.1 to 15 wt.- % of a polyalkylene glycol or polyalkylene glycolamine or the mixtures thereof, (D) 0 to 70 wt.- % of further additives, whereby the sum of the weight percentages of components (A) to (D) always adds up to 100 %.

    ANTISTATISCHE POLYOXYMETHYLENFORMMASSEN

    公开(公告)号:DE50101994D1

    公开(公告)日:2004-05-19

    申请号:DE50101994

    申请日:2001-06-22

    Applicant: BASF AG

    Abstract: The invention relates to thermoplastic molding compounds, comprising at least (A) 10 to 99.99 wt.-% of a polyoxymethylene homopolymer or copolymer, at least (B) 0.01 to 5 wt.-% of a polyethylenimine homopolymer or copolymer, at least (C) 0.1 to 15 wt.-% of a polyalkylene glycol or polyalkylene glycolamine or the mixtures thereof, (D) 0 to 70 wt.-% of further additives, whereby the sum of the weight percentages of components (A) to (D) always adds up to 100%.

    8.
    发明专利
    未知

    公开(公告)号:DE3826950A1

    公开(公告)日:1990-02-22

    申请号:DE3826950

    申请日:1988-08-09

    Applicant: BASF AG

    Abstract: Polyamide molding materials having high heat distortion resistance for the production of blow-molded articles contain essentially two highly viscous polyamides which are homogeneously miscible with one another and have melting points which differ by 10 DEG -50 DEG C., the amount of the polyamide having the low melting point being from 5 to 40% by weight and the amount of that having the high melting point being from 60 to 95% by weight.

    ANTISTATIC POLYOXYMETHYLENE MOLDING COMPOUNDS

    公开(公告)号:PL359156A1

    公开(公告)日:2004-08-23

    申请号:PL35915601

    申请日:2001-06-22

    Applicant: BASF AG

    Abstract: The invention relates to thermoplastic molding compounds, comprising at least (A) 10 to 99.99 wt.-% of a polyoxymethylene homopolymer or copolymer, at least (B) 0.01 to 5 wt.-% of a polyethylenimine homopolymer or copolymer, at least (C) 0.1 to 15 wt.-% of a polyalkylene glycol or polyalkylene glycolamine or the mixtures thereof, (D) 0 to 70 wt.-% of further additives, whereby the sum of the weight percentages of components (A) to (D) always adds up to 100%.

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