公开(公告)号：DE3625263A1

公开(公告)日：1988-02-04

申请号：DE3625263

申请日：1986-07-25

Applicant: BASF AG

Inventor： PORTUGALL MICHAEL DR ,  STERZEL HANS-JOSEF DR ,  BLINNE GERD DR ,  VONDENHAGEN HEINZ-DIETER ,  SEILER ERHARD DR ,  SCHMIDT HANS-FRIEDRICH DR ,  TOMKEWITSCH SYBILLE VON

IPC: H01L23/14 ,  H05K1/03 ,  H05K3/46 ,  H01L23/06 ,  H01L23/30 ,  H01L21/84 ,  H05K3/28 ,  H01B3/42 ,  B32B15/08 ,  B32B27/36

Abstract: In microelectronic components and thick-film hybrid circuits, the multilayer substrates of the said components and the substrates of the said circuits are produced using liquid crystalline polymers which can be processed by a thermoplastic method.