公开(公告)号：BR112014000453A2

公开(公告)日：2017-02-14

申请号：BR112014000453

申请日：2012-07-11

Applicant: BASF SE

Inventor： BERND TROTTE ,  CHRISTIAN MALETZKO ,  CLAUDIA METTLACH ,  MARTIN WEBER

IPC: A61J9/00 ,  C08G75/23

公开(公告)号：MY150816A

公开(公告)日：2014-02-28

申请号：MYPI20112157

申请日：2009-11-12

Applicant: BASF SE

Inventor： MARTIN WESSER ,  CHRISTIAN MALETZKO ,  GERHARD LANGE ,  JÖRG ERBES ,  MATTHIAS DIETRICH ,  NICOLAS INCHAURRONDO ,  TOBIAS KORTEKAMP ,  BERND TROTTE

IPC: C08G65/00

Abstract: THE PRESENT INVENTION RELATES TO A METHOD FOR MANUFACTURING A POLYMER COMPOSITION COMPRISING (A) PREPARING AT LEAST ONE POLYARYLENE ETHER (P) HAVING PRIMARILY PHENOLATE END GROUPS IN THE PRESENCE OF A SOLVENT (L), (B) ADDING AT LEAST ONE MULTIFUNCTIONAL CARBOXYLIC ACID AND (C) EXTRACTING THE POLYMER COMPOSITION AS A SOLID. THE PRESENT INVENTION ALSO RELATES TO POLYMER COMPOSITIONS OBTAINED USING SAID METHOD, TO MIXTURES COMPRISING SAID POLYARYENE ETHERS AND TO THE USE OF THE POLYMER COMPOSITIONS ACCORDING TO THE INVENTION FOR MODIFYING THE STRENGTH OF EPOXY RESINS

公开(公告)号：MY147889A

公开(公告)日：2013-01-31

申请号：MYPI20095546

申请日：2008-06-24

Applicant: BASF SE

Inventor： CHRISTIAN MALETZKO ,  RUEDIGER BLUHM ,  BERND TROTTE ,  GUENTER SCHERER ,  ARNO BOEHM

IPC: C08K5/3447

Abstract: THE INVENTION RELATES TO THERMOPLASTIC MOLDING MATERIALS COMPRISING (A) FROM 34 TO 99.99% BY WEIGHT OF AT LEAST ONE THERMOPLASTIC POLYMER SELECTED FROM (I) POLYARYLENE ETHERS, (II) POLYETHERIMIDES, (III) POLYARYLENE SULFIDES AND (IV) POLYCARBONATES HAVING A GLASS TRANSITION TEMPERATURE OF AT LEAST 145°C, AND TO COPOLYMERS OF THE AFOREMENTIONED POLYMERS (I) TO (IV), (B) FROM 0.01 TO 10% BY WEIGHT OF AT LEAST ONE ORGANIC BLACK PIGMENT WHICH IS TRANSPARENT IN THE RANGE FROM 1000 NM TO 1600 NM AND HAS A THERMAL STABILITY UNDER DLN EN 12877-1 OF AT LEAST 300°C, (C) FROM 0 TO 6% BY WEIGHT OF AT LEAST ONE DEMOLDING AGENT SELECTED FROM FATTY ACIDS, ESTERS AND AMIDES, (D) FROM 0 TO 50% BY WEIGHT OF ONE OR MORE ADDITIVES, WHERE THE SUM OF THE PERCENTAGES BY WEIGHT OF (A), (B), (C) AND (D) ADDS UP TO 100% BY WEIGHT. THE INVENTION FURTHER RELATES TO A PROCESS FOR PREPARING THE THERMOPLASTIC MOLDING MATERIALS AND TO THE MOLDINGS OBTAINABLE THEREFROM. THE INVENTION FINALLY RELATES TO THE USE OF THE THERMOPLASTIC MOLDING MATERIALS FOR REDUCING THE ACCUMULATION OF HEAT IN PLASTIC COMPONENTS, MOLDINGS, FILMS OR MEMBRANES.