公开(公告)号：MY147889A

公开(公告)日：2013-01-31

申请号：MYPI20095546

申请日：2008-06-24

Applicant: BASF SE

Inventor： CHRISTIAN MALETZKO ,  RUEDIGER BLUHM ,  BERND TROTTE ,  GUENTER SCHERER ,  ARNO BOEHM

IPC: C08K5/3447

Abstract: THE INVENTION RELATES TO THERMOPLASTIC MOLDING MATERIALS COMPRISING (A) FROM 34 TO 99.99% BY WEIGHT OF AT LEAST ONE THERMOPLASTIC POLYMER SELECTED FROM (I) POLYARYLENE ETHERS, (II) POLYETHERIMIDES, (III) POLYARYLENE SULFIDES AND (IV) POLYCARBONATES HAVING A GLASS TRANSITION TEMPERATURE OF AT LEAST 145°C, AND TO COPOLYMERS OF THE AFOREMENTIONED POLYMERS (I) TO (IV), (B) FROM 0.01 TO 10% BY WEIGHT OF AT LEAST ONE ORGANIC BLACK PIGMENT WHICH IS TRANSPARENT IN THE RANGE FROM 1000 NM TO 1600 NM AND HAS A THERMAL STABILITY UNDER DLN EN 12877-1 OF AT LEAST 300°C, (C) FROM 0 TO 6% BY WEIGHT OF AT LEAST ONE DEMOLDING AGENT SELECTED FROM FATTY ACIDS, ESTERS AND AMIDES, (D) FROM 0 TO 50% BY WEIGHT OF ONE OR MORE ADDITIVES, WHERE THE SUM OF THE PERCENTAGES BY WEIGHT OF (A), (B), (C) AND (D) ADDS UP TO 100% BY WEIGHT. THE INVENTION FURTHER RELATES TO A PROCESS FOR PREPARING THE THERMOPLASTIC MOLDING MATERIALS AND TO THE MOLDINGS OBTAINABLE THEREFROM. THE INVENTION FINALLY RELATES TO THE USE OF THE THERMOPLASTIC MOLDING MATERIALS FOR REDUCING THE ACCUMULATION OF HEAT IN PLASTIC COMPONENTS, MOLDINGS, FILMS OR MEMBRANES.

公开(公告)号：MY146822A

公开(公告)日：2012-09-28

申请号：MYPI20095478

申请日：2008-06-19

Applicant: BASF SE

Inventor： MARTIN WEBER ,  RUEDIGER BLUHM ,  CHRISTIAN MALETZKO ,  GERHARD LANGE ,  JOERG ERBES

IPC: C08K5/09

Abstract: A THERMOPLASTIC MOLDING COMPOSITION, COMPRISING: A) FROM 40 TO 97.9% BY WEIGHT OF AT LEAST ON E POLYETHER SULFONE, B) FROM 2 TO 59.9% BY WEIGHT OF AT LEAST ONE POLYSULFONE, C) FROM 0.1 TO 2% BY WEIGHT OF STEARIC ACID, AND ALSO, IF APPROPRIATE, FURTHER ADDITIVES AND AUXILIARIES, HAS IMPROVED FLOWABILITY, SURFACE QUALITY, AND NOTCHED IMPACT RESISTANCE, AND CAN BE USED FOR THE CONSTRUCTION OF HEADLAMPS.