公开(公告)号：BRPI0716056A2

公开(公告)日：2013-08-06

申请号：BRPI0716056

申请日：2007-08-07

Applicant: BASF SE

Inventor： EIBECK PETER ,  ENGELMANN JOCHEN ,  NEUHAUS RALF ,  BERNNART ANKA

IPC: C08K7/14 ,  C08K13/04

Abstract: Thermoplastic molding compositions, comprising: (A) from 20 to 85% by weight of at least one polyamide whose number of amino end groups is ≧50 mmol/kg, (B) from 14.9 to 60% by weight of glass fibers. (C) from 0.01 to 2% by weight of at least one heat stabilizer, (D) from 0 to 1.5% by weight of at least one mold-release agent, and (E) from 0 to 30% by weight of other additives, where the total of the percentages by weight of (A)-(E) is 100.