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公开(公告)号:SG11202101938QA
公开(公告)日:2021-04-29
申请号:SG11202101938Q
申请日:2019-09-26
Applicant: BASF SE
Inventor: LINDNER JEAN-PIERRE BERKAN , CSIHONY SZILARD , LOEFFLER DANIEL , BURK YENI , GERKE BIRGIT , PIRRUNG FRANK , HENDERSON LUCAS BENJAMIN , BOYKO VOLODYMYR , DE OLIVEIRA RUI , HENNIG INGOLF , YU MIRAN
IPC: C08L63/00
Abstract: A resin composition, comprising (a) at least one epoxy resin, and (b) at least one siloxane-type curing agent of formula C22 or C31 (C22) (C31) wherein the resin composition does essentially not contain any fluoride or bromide.