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公开(公告)号:MY185102A
公开(公告)日:2021-04-30
申请号:MYPI2014002687
申请日:2013-03-20
Applicant: BASF SE
Inventor: ENGELMANN JOCHEN , USKE KLAUS , ROTH MICHAEL , KONIG ALEXANDER , ERDMANN TORSTEN , EBENAU AXEL , KLATT MARTIN
Abstract: The invention relates to thermoplastic moulding compounds which contain A) 10 to 98 wt.% of a thermoplastic polyamide, B) 0.1 to 60 wt.% of red phosphorus, C) 0.5 to 20 wt.% of a melamine compound, D) 1 to 30 wt.% of rutile-type titanium dioxide, E) 0 to 40 wt.% of an impact modifier, and F) 0 to 60 wt.% of further additives, the sum of the weight percentages of components A) to F) totalling 100%.