-
1.
公开(公告)号:WO1983002784A1
公开(公告)日:1983-08-18
申请号:PCT/US1983000168
申请日:1983-02-04
Applicant: BATTELLE DEVELOPMENT CORPORATION
IPC: C25D01/00
CPC classification number: C25D1/00 , C25D1/20 , H05K3/0014 , H05K3/025
Abstract: A die (12) used for plastic injection molding is masked on its inner surface with a plating resist (11) to leave only a selected area exposed. A conforming anode (14) is fit into the die leaving a small clearance between the die cavity surface and the anode. A metal layer (16) is electroplated onto the exposed mold surfaces of the die in less than a minute by using a high current density and a turbulent flow of electroplating solution. The die is then assembled with a second die (12A) to form a mold. A plastic molding composition is injected into the mold cavity (19) and comes in contact with and adheres to the metal electroplate (16) more tightly than the metal electroplate adheres to the surface of the mold member. As the mold is separated, the metal electroplate reamins bonded to the plastic molding composition to form a metal-clad plastic article (26). Adhesion between the metal electroplate and the plastic can be improved by forming nodular growths on the metal electroplate. This is done by varying the current density and/or the electroplating solution flow-rate near the end of the electroplating process. The electroplating and molding steps may be sequentially combined into an automated process for the continuous production of metal-clad articles.
Abstract translation: 用于塑料注射成型的模具(12)在其内表面上用电镀抗蚀剂(11)掩蔽,仅留下被选择的区域暴露。 将合适的阳极(14)装配到模具中,在模腔表面和阳极之间留下小的间隙。 金属层(16)通过使用高电流密度和电镀溶液的湍流,在不到一分钟的时间内将电镀电镀在裸露的模具表面上。 然后将模具与第二模具(12A)组装以形成模具。 塑料模塑组合物被注入到模具腔(19)中,并且与金属电镀板粘附到模具构件的表面更紧密地接触并粘附到金属电镀板(16)上。 当模具被分离时,金属电镀板结合到塑料模制组合物上以形成金属包覆的塑料制品(26)。 可以通过在金属电镀板上形成结节生长来改善金属电镀板和塑料之间的粘合性。 这是通过改变在电镀过程结束附近的电流密度和/或电镀溶液流速来完成的。 电镀和模制步骤可以顺序地组合成用于连续生产金属包覆制品的自动化工艺。
-
公开(公告)号:WO1986004015A1
公开(公告)日:1986-07-17
申请号:PCT/US1986000038
申请日:1986-01-08
Applicant: BATTELLE DEVELOPMENT CORPORATION
IPC: B29C37/00
CPC classification number: C25D1/20 , B29C41/006 , B29K2025/00 , B29K2055/00 , C08G61/122 , C08G61/123 , H01M4/60 , H05K1/09 , H05K3/0014 , H05K3/20
Abstract: A novel in-mold electrodeposition process for the production of plastic parts having conductive polymeric coatings such as polypyrroles or polythiophenes. Parts produced according to the novel disclosed in-mold electrodeposition process would have wide applicability including static free plastic parts shielding devices and circuits. The disclosed process advances the art by enabling the utilization of conductive polymers many of which were heretofore considered too brittle for commercial adaptation.
-
公开(公告)号:EP0211036A1
公开(公告)日:1987-02-25
申请号:EP86900906.0
申请日:1986-01-08
Applicant: BATTELLE DEVELOPMENT CORPORATION
Inventor: PRESTON, Joseph, R. , HILLENBRAND, Louis, J.
IPC: C08J7 , B29C33 , B29C41 , B29C43 , B29C45 , C08G61 , C25D1 , H01B1 , H01B13 , H01M4 , H05K1 , H05K3
CPC classification number: C25D1/20 , B29C41/006 , B29K2025/00 , B29K2055/00 , C08G61/122 , C08G61/123 , H01M4/60 , H05K1/09 , H05K3/0014 , H05K3/20
Abstract: Un procédé de galvanoplastie nouveau est décrit, pour la fabrication de pièces de plastique possédant des revêtements polymères conducteurs, comme des polypyroles ou des polythiophènes. Les pièces produites selon le nouveau procédé de galvanoplastie décrit auront un large domaine d'application, dont des pièces de plastique exemptes d'électricité statique des circuits et des dispositifs de blindage. Le procédé décrit fait progresser la technique en permettant l'utilisation de polymères conducteurs, dont beaucoup étaient jusque là considérés comme trop fragiles pour des applications commerciales.
-
-