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6 records (took 0.018 seconds)

    1.
    发明专利
    未知

    公开(公告)号：SE7806885L

    公开(公告)日：1978-12-17

    申请号：SE7806885

    申请日：1978-06-14

    Applicant: BENDIX CORP

    Inventor： CARP R W ,  LEADBETTER L D ,  ANG L T ,  CORNELL G A

    IPC: B60T8/58 ,  B60T8/174 ,  B60T8/1761 ,  B60T8/64 ,  B60T8/66 ,  B60T8/72 ,  B60T8/02

    Abstract: An adaptive braking system for a vehicle having fluid pressure operated brakes includes a skid detecting circuit for generating a signal when an incipient skidding condition is detected, a pressure command generator which is responsive to the skid detecting signal for generating a pressure command signal proportional to the optimum fluid pressure level in the vehicle's brakes, and a duty cycle translator responsive to the pressure command signal to actuate the brake pressure modulator. Of course, since the pressure level in the vehicle brakes cannot drop below zero, the value of the pressure command signal generated by the pressure command generator cannot drop below a predetermined level. If the skid detecting circuit continues to generate a signal indicating an incipient skidding condition after the pressure command signal is at its lowest level, the subsequent brake pressure increase which is normally initiated upon termination of the skid detecting signal is delayed for a time period which is a function of the time period in which the skid detecting signal was generated after the value of the pressure command signal had dropped to the lowest permissible level.

    2.
    发明专利
    未知

    公开(公告)号：SE421058B

    公开(公告)日：1981-11-23

    申请号：SE7806885

    申请日：1978-06-14

    Applicant: BENDIX CORP

    Inventor： CARP R W ,  LEADBETTER L D ,  ANG L T ,  CORNELL G A

    IPC: B60T8/58 ,  B60T8/174 ,  B60T8/1761 ,  B60T8/64 ,  B60T8/66 ,  B60T8/72 ,  B60T8/02

    Abstract: An adaptive braking system for a vehicle having fluid pressure operated brakes includes a skid detecting circuit for generating a signal when an incipient skidding condition is detected, a pressure command generator which is responsive to the skid detecting signal for generating a pressure command signal proportional to the optimum fluid pressure level in the vehicle's brakes, and a duty cycle translator responsive to the pressure command signal to actuate the brake pressure modulator. Of course, since the pressure level in the vehicle brakes cannot drop below zero, the value of the pressure command signal generated by the pressure command generator cannot drop below a predetermined level. If the skid detecting circuit continues to generate a signal indicating an incipient skidding condition after the pressure command signal is at its lowest level, the subsequent brake pressure increase which is normally initiated upon termination of the skid detecting signal is delayed for a time period which is a function of the time period in which the skid detecting signal was generated after the value of the pressure command signal had dropped to the lowest permissible level.

    3.
    发明专利
    未知

    公开(公告)号：SE7806921L

    公开(公告)日：1978-12-17

    申请号：SE7806921

    申请日：1978-06-15

    Applicant: BENDIX CORP

    Inventor： CARP R W ,  WALKER JR B E ,  HYDER R J ,  GOSNELL SR T F ,  LEADBETTER L D

    IPC: H05K5/00 ,  H01L23/02 ,  H05K3/32 ,  H05K3/34 ,  H05K7/02 ,  H05K7/14 ,  H05K1/04

    Abstract: A package assembly for an electronic mechanism includes a housing which receives an electronic circuit board. Studs carried by the housing are connected to the circuit board by a flexible mechanism so that vibrations are dampened and thermal expansion of the connecting mechanism is accommodated. The connecting mechanism not only supports the circuit board within the housing, but also provides an electrical connection between the terminals on the circuit board and the studs, to which the electrical leads are installed which connect the package to other electronic components.

    4.
    发明专利
    未知

    公开(公告)号：SE432336B

    公开(公告)日：1984-03-26

    申请号：SE7806921

    申请日：1978-06-15

    Applicant: BENDIX CORP

    Inventor： CARP R W ,  WALKER JR B E ,  HYDER R J ,  GOSNELL SR T F ,  LEADBETTER L D

    IPC: H05K5/00 ,  H01L23/02 ,  H05K3/32 ,  H05K3/34 ,  H05K7/02 ,  H05K7/14

    Abstract: A package assembly for an electronic mechanism includes a housing which receives an electronic circuit board. Studs carried by the housing are connected to the circuit board by a flexible mechanism so that vibrations are dampened and thermal expansion of the connecting mechanism is accommodated. The connecting mechanism not only supports the circuit board within the housing, but also provides an electrical connection between the terminals on the circuit board and the studs, to which the electrical leads are installed which connect the package to other electronic components.

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