公开(公告)号：SE7812566A

公开(公告)日：1979-06-10

申请号：SE7812566

申请日：1978-12-06

Applicant: BENDIX CORP

Inventor： ANG L T ,  WALKER JR B E ,  WEBER R E

IPC: B60T13/66 ,  B60T8/172 ,  B60T8/174 ,  B60T8/1761 ,  B60T8/1763 ,  B60T8/62 ,  B60T8/88 ,  B60T17/22

CPC classification number: B60T8/17613

公开(公告)号：SE7806921L

公开(公告)日：1978-12-17

申请号：SE7806921

申请日：1978-06-15

Applicant: BENDIX CORP

Inventor： CARP R W ,  WALKER JR B E ,  HYDER R J ,  GOSNELL SR T F ,  LEADBETTER L D

IPC: H05K5/00 ,  H01L23/02 ,  H05K3/32 ,  H05K3/34 ,  H05K7/02 ,  H05K7/14 ,  H05K1/04

Abstract: A package assembly for an electronic mechanism includes a housing which receives an electronic circuit board. Studs carried by the housing are connected to the circuit board by a flexible mechanism so that vibrations are dampened and thermal expansion of the connecting mechanism is accommodated. The connecting mechanism not only supports the circuit board within the housing, but also provides an electrical connection between the terminals on the circuit board and the studs, to which the electrical leads are installed which connect the package to other electronic components.

公开(公告)号：SE440211B

公开(公告)日：1985-07-22

申请号：SE7812566

申请日：1978-12-06

Applicant: BENDIX CORP

Inventor： ANG L T ,  WALKER JR B E ,  WEBER R E

IPC: B60T13/66 ,  B60T8/172 ,  B60T8/174 ,  B60T8/1761 ,  B60T8/1763 ,  B60T8/62 ,  B60T8/88 ,  B60T17/22

公开(公告)号：SE432336B

公开(公告)日：1984-03-26

申请号：SE7806921

申请日：1978-06-15

Applicant: BENDIX CORP

Inventor： CARP R W ,  WALKER JR B E ,  HYDER R J ,  GOSNELL SR T F ,  LEADBETTER L D

IPC: H05K5/00 ,  H01L23/02 ,  H05K3/32 ,  H05K3/34 ,  H05K7/02 ,  H05K7/14

Abstract: A package assembly for an electronic mechanism includes a housing which receives an electronic circuit board. Studs carried by the housing are connected to the circuit board by a flexible mechanism so that vibrations are dampened and thermal expansion of the connecting mechanism is accommodated. The connecting mechanism not only supports the circuit board within the housing, but also provides an electrical connection between the terminals on the circuit board and the studs, to which the electrical leads are installed which connect the package to other electronic components.

公开(公告)号：SE7812566L

公开(公告)日：1979-06-10

申请号：SE7812566

申请日：1978-12-06

Applicant: BENDIX CORP

Inventor： ANG L T ,  WALKER JR B E ,  WEBER R E

IPC: B60T13/66 ,  B60T8/172 ,  B60T8/174 ,  B60T8/1761 ,  B60T8/1763 ,  B60T8/62 ,  B60T8/88 ,  B60T17/22

公开(公告)号：SE7806921A

公开(公告)日：1978-12-17

申请号：SE7806921

申请日：1978-06-15

Applicant: BENDIX CORP

Inventor： CARP R W ,  WALKER JR B E ,  HYDER R J ,  GOSNELL SR T F ,  LEADBETTER L D

IPC: H05K5/00 ,  H01L23/02 ,  H05K3/32 ,  H05K3/34 ,  H05K7/02 ,  H05K7/14 ,  H05K1/04

CPC classification number: H05K3/3405 ,  H01L2924/0002 ,  H05K3/325 ,  H05K7/1417 ,  H05K2201/0311 ,  H05K2201/10386 ,  H05K2201/10962 ,  H01L2924/00