Abstract:
PROBLEM TO BE SOLVED: To prevent corrosion of external conductor path and external contact connecting section by providing an external conductor path and external contact connection section composed of silver on the external surface of a sheet laminating body during or after the sintering process and then providing a metal protection film to the external conductor path and external contact connecting section. SOLUTION: A through-contact hole 1 is punched on the unbaked ceramic sheet and the through-contact hole 1 is filled with conductive paste such as silver paste. Next, a conductive path 2 consisting of a conductive material such as pure silver is printed on the ceramic sheet. Moreover, a laminated body 3 is formed by stacking the ceramic sheet and is then coupled in the pressing process. In addition, during or after the sintering process, an external conductive path 4 and external contact connecting section 5 consisting of silver are formed without formation of the intermediate conductive path 6. A metal protection film such as a nickel film or a gold film is formed on the external conductive path 4 and external contact connecting section 5 with an electrolytic plating process.
Abstract:
The invention relates to a lead-through device (1) through a metal plate (4) for at least one electrical connection element (6) to form an electronic circuit (8). For this purpose, the lead-through device (1) comprises a sealing element (10) which has a disc-shaped sealing element edge region (12) and a central lead-through region (14). The central lead-through region (14) encloses the at least one electrical connection element (6) in a media-tight manner. An opening edge region (16) of a lead-through opening (18) in the metal plate (4) is matched to the sealing element edge region (12) in a media-tight manner. A cylindrical portion (20) of the sealing element (10) in the sealing element edge region (12) has an outside diameter (DA) which is greater than an inside diameter (Di) of the lead-through opening (18), such that the cylindrical portion (20) forms a press fit in the lead-through opening (18). The cylindrical portion (20) has a pot-shaped sealing element region (40) which is in engagement with the lead-through opening (18) in the opening edge region (16).
Abstract:
A ceramic multilayer circuit and a method for manufacturing a ceramic multilayer circuit which has economical, corrosion-resistant external contacts or external conductor paths that are immune to the Kirkendall effect and can be utilized for different mounting processes. The circuit structure and the method involve the use of a pure silver paste to implement external conductor paths or external contacts. Corrosion resistance is ensured by a thin metallic protective layer.
Abstract:
A piezo-electric control device is used to restrain movement of the armature of an electromagnet until the current through the exciter winding of the electromagnet has reached almost the maximum value. This causes the force applied to the armature to be the maximum force from the start of movement, so that the overall time required for movement of the armature from its starting to its end position is substantially decreased. Specifically, the piezo-electric control device is a column of discs having an axis perpendicular to the axis of movement of the armature. When electrical energy is applied to the column it expands in the axial direction causing a locking member mounted on its end to engage a stop member which is part of the armature. The locking member can either push the stop member against a further rigid stop or two columns can be used to clamp the stop member between them.
Abstract:
Verfahren zur Herstellung einer leitenden Beschichtung auf einem isolierenden Substrat, gekennzeichnet durch folgende Schritte:- wenigstens eine Oberfläche des elektrisch isolierenden Substrats wird in Bereichen mit einer Beschichtung aus Silber versehen, wobei die Beschichtung aus Silber die Struktur von Leiterbahnen aufweist,- die beschichtete Oberfläche wird gereinigt,- die Beschichtung aus Silber auf dem Substrat wird zur Ausbildung einer Keimschicht mit Keimen aus Palladium bekeimt,- auf die mit Palladium bekeimte Beschichtung aus Silber wird eine Schicht aus Palladium abgeschieden,- das mit Silber und Palladium beschichtete Substrat wird durch einen Brennvorgang gebrannt
Abstract:
Die Erfindung betrifft eine Durchführungsvorrichtung (1) durch ein Metallblech (4) für mindestens ein Elektroverbindungselement (6) zu einer elektronischen Schaltung (8). Dazu weist die Durchführungsvorrichtung (1) ein Dichtelement (10) auf, das einen scheibenförmigen Dichtelementrandbereich (12) und einen zentralen Durchführungsbereich (14) hat. Der zentrale Durchführungsbereich (14) umschließt das mindestens eine Elektroverbindungselement (6) mediendicht. Ein Öffnungsrandbereich (16) einer Durchführungsöffnung (18) in dem Metallblech (4) ist mediendicht dem Dichtelementrandbereich (12) angepasst. Ein zylinderförmiger Abschnitt (20) des Dichtelements (10) in dem Dichtelementrandbereich (12) weist einen Außendurchmesser (DA) auf, der größer als ein Innendurchmesser (DI) der Durchführungsöffnung (18) ist, so dass der zylinderförmige Abschnitt (20) in der Durchführungsöffnung (18) einen Presssitz bildet. Der zylinderförmige Abschnitt (20) weist einen topfförmigen Dichtelementbereich (40) auf, der in dem Öffnungsrandbereich (16) mit der Durchführungsöffnung (18) in Eingriff steht.