公开(公告)号：AT523263T

公开(公告)日：2011-09-15

申请号：AT05705442

申请日：2005-01-07

Applicant: BREWER SCIENCE INC

Inventor： LI CHENGHONG ,  RUBEN KIMBERLY ,  FLAIM TONY

IPC: B05D1/36 ,  B32B9/04 ,  B81C1/00 ,  C09D125/12 ,  H01L21/308 ,  H01L21/311

Abstract: New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and optionally other addition-polymerizable monomers such as (meth)acrylate monomers, vinylbenzyl chloride, and diesters of maleic acid or fumaric acid. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer which may or may not be crosslinked upon heating.